Samsung Electronics Co., Ltd.

Yoodong Yang

Hyunho Choi

Sungseung Lim

Hyunsu Seol

Yujin Han

Provided is a semiconductor fabrication facility including a chamber, a gas supply configured to provide reaction gas to the chamber, a plurality of vacuum pumps respectively configured to pump the reaction gas from the chamber, an exhaust apparatus that is connected to the plurality of vacuum pumps and configured to purify the reaction gas, an exhausting line between the exhaust apparatus and the plurality of vacuum pumps, a thickness detection apparatus connected to the exhausting line and configured to detect a thickness of a byproduct layer in the exhausting line, and a processor connected to the thickness detection apparatus and configured to display preventive maintenance of the exhausting line based on the thickness of the byproduct layer being greater than a threshold value.

Semiconductor fabrication facility

A film forming apparatus including a bell-shaped chamber having an internal space and an exhaust port; a wafer boat in the bell-shaped chamber, and in which wafers are sequentially stackable from a lower end portion to an upper end portion; a gas supply pipe passing through the bell-shaped chamber to supply gas to the bell-shaped chamber; and an injector connected to the gas supply pipe to inject gas onto the wafers, wherein the injector includes a gas flow path through which the gas supplied from the gas supply pipe flows and nozzles connected to the gas flow path, stepped surfaces are on an inner surface of the injector such that a diameter of the gas flow paths in at least two different locations within the injector are different, and lengths of the nozzles are different from each other, and correspond with the diameter of the gas flow path.

Growing community of inventors

Hwaseong-si, South Korea

Yoodong Yang