Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Yoo-Seong Yang

Byung-hee Sohn

Sang-Mo Kim

Eun-Seog Cho

Young-Suk Jung

Eun-Sung Lee

Sang-Soo Jee

Soon-Jae Kwon

Jin-Young Bae

A carbon/epoxy composition includes a bisphenol-based epoxy, an amine-based curing agent, an imidazole-based curing catalyst, and carbon black. A carbon-epoxy dielectric layer is fabricated using a reaction product of the carbon/epoxy composition.

Carbon/epoxy resin composition, and carbon-epoxy dielectric film produced by using the same

A polyamic acid that is a condensation reaction product of one or more acid anhydrides and one or more carbonate-based diamine compounds, along with a polyimide obtained by imidizing the polyamic acid, a method of manufacturing the same, and a polyimide film made therefrom.

Polyamic acid, polyimide, manufacturing method thereof, and polyimide film

A polymer including a structure represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above Chemical Formula 1, each substituent is as defined in the detailed description.

Polymer, and composition and film including the same

A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Carbon/epoxy resin composition and method of producing a carbon-epoxy dielectric film using the same

Disclosed are an organosilicate compound represented by the following Chemical Formula 1, and a composition and a film including the same.  In the above Chemical Formula 1, each substituent is as defined in the detailed description.

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Yongin-si, South Korea

Yoo-Seong Yang