Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Samsung Fine Chemicals Co., Ltd.

Yoo Seong Yang

Young Suk Jung

Chung Kun Cho

Sang Mo Kim

Eun Seog Cho

Tai Gyoo Park

Seung Jae Lee

Myung Sup Jung

Hyun Seok Kim

Young Hoon Lee

Jae Eun Kim

Byung Hee Sohn

Kalinina Fedosya

Hyo Rang Kang

Joon Seon Jeong

Kovalev Mikhail

Ga Hee Kim

Bon Hyeok Gu

Sang Hyuk Suh

Hyun Mi Lee

A deformation measuring apparatus of a specimen includes: a holder which supports the specimen; a contact portion disposed facing the holder and including a hemispherical tip; a position controlling portion which adjusts a position of the contact portion along a thickness direction of the specimen to allow the hemispherical tip to be in contact with a surface of the specimen; a heating chamber which accommodates the holder and the contact portion and heating the specimen; and a sensing portion which measures at least one of a thermal deformation force (F) of the specimen or a thickness direction thermal expansion (&#x394;h) of the specimen.

Deformation measuring apparatus and method of evaluating deformation using thereof

A capacitive deionization electrode may include a conductive material and a polymer on a surface of the conductive material. The polymer may have at least one functional group in a single polymer chain.

Capacitive deionization electrodes, capacitive deionization apparatuses including the same, and production methods thereof

Provided are a polyamide combination that includes: a first polyamide including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second polyamide including a repeating unit represented by Chemical Formula 3, and a film prepared using the polyamide combination. 

Polyamide combination film prepared by using same, and display device including the film

A polyimide precursor composition includes a polyamic acid including a repeating unit represented by Chemical Formula 1 and diisocyanate represented by Chemical Formula 2. OCN-A-NCO&#x2003;&#x2003;Chemical Formula 2 The diisocyanate represented by Chemical Formula 2 is included in an amount of about 0.01 moles to about 10 moles based on 100 moles of the repeating unit represented by Chemical Formula 1 in the polyamic acid.

Polyimide precursor composition, method for preparing polyimide, polyimide prepared by using the method, and film including the polyimide

A polymer including a structural unit represented by the following Chemical Formula 1, and a composition and a film including the same are provided. In the above formula at least one of Rand Ris either Chemical Formula 3 or Chemical Formula 4, as shown below. The polymer also includes units selected from polyamic acid, polyimide, polyaramid, polyamide, polyurethane, polycarbonate and polyacetal units and mixtures of such units.

Polymer, and composition and film including the same

A composition for producing a printed circuit board is provided. The composition includes a polyamic acid having one or two crosslinkable functional groups introduced at one or both ends thereof, a liquid crystal polymer (LCP) or a liquid crystalline thermoset (LCT) oligomer, and an organic solvent. Therefore, the composition can be used as a material for next-generation boards that are becoming gradually lighter in weight and smaller in thickness and size. Further provided is a printed circuit board produced using the composition.

Composition for producing printed circuit board and printed circuit board using the same

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Yongin-si, South Korea

Yoo Seong Yang