Samsung Electronics Co., Ltd.

Yoo Jin Jeoung

Janghee Lee

Yusin Yang

Chungsam Jun

Sung Yoon Ryu

Jaehyung Ahn

Wahseng Yap

Joonseo Song

Yunjung Jee

A method of inspecting a semiconductor wafer is provided, the method includes scanning a plurality of inspection swaths on a wafer to obtain a plurality of image sets and producing a plurality of reference images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer further includes selecting a plurality of target images from the plurality of image sets, respectively. The method of inspecting a semiconductor wafer additionally includes comparing each reference image of the plurality of reference images with each target image of the plurality of target images to detect a defect image from each of the plurality of target images. A reference image being compared and a target image being compared are images scanned from the same inspection swath.

Method of inspecting semiconductor wafer, an inspection system for performing the same, and a method of fabricating semiconductor device using the same

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Suwon-si, South Korea

Yoo Jin Jeoung