Applied Materials, Inc.

Yonqi Hu

Liang-Yuh Chen

Feng Quan Liu

Stan D Tsai

Paul D Butterfield

Lizhong Sun

Alain Duboust

Rashid Mavliev

Antoine P Manens

Ralph M Wadensweiler

Siew Neo

Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.

Conductive polishing article for electrochemical mechanical polishing

Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes a ring-shaped upper layer having a polishing surface, and a conductive layer coupled to the upper layer and forming a replaceable assembly therewith.

Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.

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San Jose, CA, United States of America

Yonqi Hu