Electronics and Telecommunications Research Institute

Phovelco.ltd.

Yongsoon Baek

Young-Tak Han

Jang Uk Shin

Sang Ho Park

Sang-Pil Han

Dong-Hun Lee

Chul-Wook Lee

Young Ahn Leem

Kyung Hyun Park

Oh Kee Kwon

Namje Kim

Jaeheon Shin

Eundeok Sim

Su Hwan Oh

Won Seok Han

Duk Jun Kim

Jong-Hoi Kim

Dong-Young Kim

Sahnggi Park

Kwang-Ryong Oh

Seo Young Lee

Seoktae Kim

Seok Jun Yun

Dong Hyo Lee

Hyun Soo Kim

O-Kyun Kwon

Joon Tae Ahn

Suntak Park

Yun Chur Chung

Jong Moo Lee

Jeong Soo Kim

Byung-Seok Choi

Hyunsung Ko

Jung-Ho Song

Yun Sub Chung

Seok-Tae Kim

Sang-Ho Park

Young-Ho Ko

Jungwoo Park

Jang-Uk Shin

Seo-Young Lee

Oh-Kee Kwon

Ho Sung Kim

Kwangryong Oh

Sungbock Kim

Disclosed are a heterogeneously integrated optical modulator and a manufacturing method thereof. The modulator includes a substrate having a trench, an input waveguide disposed at one side of the trench, an output waveguide disposed at the other side of the trench, a first Mach-Zehnder interferometer including first branch waveguides disposed between the input waveguide and the output waveguide and a heater disposed on one of the first branch waveguides, and second Mach-Zehnder interferometers connected to each of the first branch waveguides.

Heterogeneously integrated optical modulator and manufacturing method thereof

Disclosed are a Mach-Zehnder interferometric optical modulator and a method for manufacturing the same. The modulator includes first and second lower clad layers, a core layer, an upper clad layer, a waveguide, and electrodes. The waveguide may include an input waveguide, a waveguide divider, branch waveguides, and a waveguide combiner. Each of the branch waveguides includes first and second connection regions connected to the waveguide combiner and the waveguide divider, respectively, and a phase shift region having a cross-section of a reverse mesa structure that has an upper width that is the same as widths of the first and second connection regions and a lower width that is smaller than the widths of the first and second connection regions.

Mach-zehnder interferometric optical modulator with shallow ridge waveguide structure and method for manufacturing the same

Disclosed is an optical transmitter module including a directly modulated laser transmitter based on a directly modulated laser (DML) and an arrayed waveguide grating (AWG) chip that is vertically polished. The directly modulated laser transmitter includes a directly modulated laser chip array including one or more directly modulated laser chips, an impedance matching circuit that allows each of the one or more directly modulated laser chips to operate at a critical speed of 100 Gbps per channel or higher, and a radio frequency-flexible printed circuit board (RF-FPCB) that transmits a radio frequency (RF) modulating signal to the directly modulated laser chip array. The arrayed waveguide grating chip includes an optical waveguides that transfer multi-channel optical signals and a wavelength multiplexer that multiplexes the multi-channel optical signals. The directly modulated laser transmitter and the arrayed waveguide grating chip are spaced apart from each other and are optically coupled in chip-to-chip.

Optical transmitter module

Provided is an optical module including an optical waveguide device through which multiple channel lightwaves are input and output, an optical transmission/reception unit disposed on one side of the optical waveguide device, an electronic IC disposed on one side of the optical transmission/reception unit and configured to drive the optical transmission/reception unit, a flexible printed circuit board (PCB) disposed on the optical transmission/reception unit and the electronic IC, a first solder ball between the optical transmission/reception unit and the flexible PCB and a second solder ball between the electronic IC and the flexible PCB.

Optical module and solder ball bonding structure

An optical waveguide structure includes a substrate and a core structure disposed on the substrate. The substrate includes a first waveguide region, a second waveguide region, and a transition region between the first waveguide region and the second waveguide region. The core structure includes first core segments arranged in a first direction and a second direction crossing the first direction on the transition region. The core structure includes second core segments arranged in the first direction and the second direction on the second waveguide region. The first direction and the second direction are parallel to a top surface of the substrate.

Optical waveguide structure

Provided is an optical transmitter module. The optical transmitter module includes a substrate, a ground layer disposed on the substrate, an electro-absorption modulated laser (EML) chip disposed on the ground layer to generate an modulated optical signal, a ground structure disposed on the EML chip and electrically connected to the ground layer, a matching resistor disposed on the ground structure, and a first bonding wire disposed between the EML chip and the matching resistor to electrically connect the EML chip to the matching resistor.

Provided is an optical module. The optical module includes: an optical bench having a first trench of a first depth and a second trench of a second depth that is lower than the first depth; a lens in the first trench of the optical bench; at least one semiconductor chip in the second trench of the optical bench; and a flexible printed circuit board covering an upper surface of the optical bench except for the first and second trenches, wherein the optical bench is a metal optical bench or a silicon optical bench.

Optical modules

Provided is an optical device. The optical device includes a substrate having a waveguide region and a mounting region, a planar lightwave circuit (PLC) waveguide including a lower-clad layer and an upper-clad layer on the waveguide region of the substrate and a platform core between the lower-clad layer and the upper-clad layer, a terrace defined by etching the lower-clad layer on the mounting region of the substrate, the terrace including an interlocking part, an optical active chip mounted on the mounting region of the substrate, the optical active chip including a chip core therein, and a chip alignment mark disposed on a mounting surface of the optical active chip. The optical active chip is aligned by interlocking between the interlocking part of the terrace and the chip alignment mark of the optical active chip and mounted on the mounting region.

Optical devices and methods of fabricating the same

Provided are structures for connecting trace lines of printed circuit boards and optical transceiver modules with the same. The module may include an optical transmitter/receiver part, a signal processing unit, a flexible PCB, and a rigid PCB. The flexible PCB may include a first signal line, and the rigid PCB may include a second signal line. The flexible PCB and the rigid PCB may be overlapped with each other. The first signal line and the second signal line may not be overlapped with each other and be electrically connected to each other by a junction soldering structure. It is possible to transmit high quality and high frequency signals through the first and second signal lines.

Structure for connecting electrical trace lines of printed circuit boards and optical transceiver module with the same

Provided is a transistor outline (TO)-CAN type optical module and an optical transmission apparatus including the same. The optical module includes a stem, a thermo-electric cooler (TEC) on the stem, a first sub-mount on the TEC, an optical element on the first sub-mount, a plurality of electrode lead wirings inserted from an outside to an inside of the stem and disposed adjacent to the TEC and the optical element, a second sub-mount between the electrode lead wirings and the optical element, radio frequency (RF) transmission lines on the second sub-mount, a plurality of bonding wires connecting the RF transmission lines and the optical element, and the RF transmission lines and the electrode lead wirings, and an impedance matching unit disposed around the RF transmission lines and the electrode lead wirings, and controlling impedances of the RF transmission lines and the electrode lead wires.

Radio frequency optical module and optical transmission apparatus including the same

Disclosed is a transmitter optical module which includes a first package generating an optical signal; a second package bonded with the first package by using chip-to-chip bonding, having a silicon optical circuit platform structure, and amplifying the optical signal; and an optical waveguide forming a transmission path of the optical signal from the first package to the second package.

Transmitter optical module

Provided are a spot size converter and a method of manufacturing the spot size converter. The method includes stacking a lower clad layer, a core layer, and a first upper clad layer on a substrate, tapering the first upper clad layer and the core layer in a first direction on a side of the substrate, forming a waveguide layer on the first upper clad layer and the lower clad layer, and etching the waveguide layer, the first upper clad layer, the core layer, and the lower clad layer such that the waveguide layer is wider than a tapered portion of the core layer on the side of the substrate and has the same width as that of the core layer on another side of the substrate.

Spot size converters and methods of manufacturing the same

Disclosed is a transmitter optical module which includes an electro-absorption modulated laser modulating a light into an optical signal through a high-frequency electrical signal; a first sub-mount transferring the high-frequency signal to the electro-absorption modulated laser; and a second sub-mount receiving the high-frequency signal from the electro-absorption modulated laser to terminate the electro-absorption modulated laser. A length of a first wire connecting the first sub-mount and the electro-absorption modulated laser is different from a length of a second wire connecting the second sub-mount and the electro-absorption modulated laser.

Growing community of inventors

Daejeon, South Korea

Yongsoon Baek