Samsung Electronics Co., Ltd.

Seoul National University

Yongseop Yoon

Jongseok Kim

Choongho Rhee

Sungchan Kang

Cheheung Kim

Hyeokki Hong

Sangha Park

Hyunwook Kang

Jangwoo You

Jinmyoung Kim

Jaehyung Jang

Wontaek Seo

Duhyun Lee

Byonggwon Song

Woonbae Kim

Namsoo Kim

Hyungyong Kim

Choong Ho Rhee

Provided are a long-wave infrared sensor and an electronic device including the same. The long-wave infrared sensor and the electronic device including the same include a pixel array including a plurality of pixels, an optical absorber layer arranged on the pixel array, and a drive circuit configured to drive the pixel array, wherein each of the plurality of pixels for a long-wave infrared sensor includes a lower electrode and an upper electrode which are arranged apart from each other, and a plurality of magnetic tunnel junction devices arranged regularly between the lower electrode and the upper electrode and electrically connected to each other in parallel, and the plurality of magnetic tunnel junction devices are arranged apart from each other with an empty space therebetween.

Long-wave infrared sensor and electronic device including the same

An infrared sensor includes a substrate, a reflective layer on an upper surface of the substrate, and a composite layer including an absorption layer including a nanostructure and configured to absorb light energy and a sensing layer including a plurality of temperature sensing cells, where the composite layer is above the upper surface of the substrate, and where the infrared ray sensor further includes a resonant cavity between the composite layer and the reflective layer.

IR sensor with nano-structure

A filter system includes a first resonator having a first resonant frequency, and a second resonator having a second resonant frequency different from the first resonant frequency, and electrically connected to the first resonator. A first response characteristic of the first resonator and a second response characteristic of the second resonator with respect to a frequency include a first section in which a first phase of the first resonator is equal to a second phase of the second resonator, and a second section in which the first phase is different from the second phase by 180 degrees. A first electrode of the first resonator is reversely connected to a second electrode of the second resonator.

Filter system including resonator

A microphone package and an electronic apparatus including the same are provided. The microphone package includes a substrate in which an acoustic hole and a via hole are formed; an acoustic sensor attached to a front surface of the substrate and covering the acoustic hole; a first electrode pad provided on the front surface of the substrate; a second electrode pad provided on a rear surface of the substrate and electrically connected to the first electrode pad through the via hole; and a third electrode pad on a side surface of the substrate and electrically connected to the second electrode pad.

Microphone package and electronic apparatus including the same

Provided is a micromechanical resonator including a support beam including a first portion supported on a support member and a second portion spaced apart from the first portion in a length direction of the support beam, and a piezoelectric sensing portion provided between the first portion and the second portion and connecting the first portion to the second portion.

Micromechanical resonator and resonator system including the same

A capacitor structure includes at least one first layer and at least one second layer that are alternately stacked. The at least one first layer includes first electrodes and second electrodes alternately arranged in a first direction, and the at least one second layer includes third electrodes and fourth electrodes alternately arranged in a second direction intersecting the first direction, the third electrodes and the fourth electrodes being electrically connected to the first electrodes and the second electrodes. Each of the first electrodes and the second electrodes includes a base portion and branch portions protruding from the base portion, and the third electrodes and the fourth electrodes are arranged side by side to correspond to the branch portions.

High-efficiency capacitor structure

An etching method for forming a vertical structure is provided. The etching method may include: positioning a mask on a substrate, wherein the mask includes an opening pattern and a compensation pattern, and the compensation pattern is disposed at a corner of two adjacent sides of the opening pattern and includes a concave compensation pattern that is indented from one of the two adjacent sides; and forming the vertical structure on the substrate through the opening pattern of the mask by a dry etching process.

Etching method for forming vertical structure, electronic device including vertical structure formed by the etching method, and method of manufacturing the electronic device

Provided are a method and device for recognizing a speaker by using a resonator. The method of recognizing the speaker includes receiving a plurality of electrical signals corresponding to a speech of the speaker from a plurality of resonators having different resonance bands; obtaining a difference of magnitudes of the plurality of electrical signals; and recognizing the speaker based on the difference of magnitudes of the plurality of electrical signals.

Method and apparatus for recognizing speaker by using a resonator

A compact directional acoustic sensor having an improved signal-to-noise ratio is disclosed. The disclosed directional acoustic sensor includes a first sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one first output signal having a first polarity based on external energy received from an input direction; a second sensing device configured to generate different output gains based on different input directions of external energy, and configured to generate at least one second output signal having a second polarity, that is different than the first polarity, based on the external energy received from the input direction; and at least one signal processor configured to generate at least one final output signal based on the at least one first output signal and the at least one second output signal.

Directional acoustic sensor

Provided are a directional acoustic sensor that detects a direction of sound, a method of detecting a direction of sound, and an electronic device including the directional acoustic sensor. The directional acoustic sensor includes a sound inlet through which a sound is received, a sound outlet through which the sound received through the sound inlet is output, and a plurality of vibration bodies arranged between the sound inlet and the sound outlet, in which one or more of the plurality of vibration bodies selectively react to the sound received by the sound inlet according to a direction of the received sound.

Directional acoustic sensor and electronic device including the same

A directional acoustic sensor may include a plurality of resonators arranged in different directions; and a processor configured to calculate a time difference between a first signal that is received by the plurality of resonators directly from a sound source (e.g., a speaker) and a second signal that is received by the plurality of resonators from the sound source after being reflected on a wall surface around the sound source, and determine a distance between the sound source and the directional acoustic sensor based on the time difference.

Directional acoustic sensor and method of detecting distance from sound source using the directional acoustic sensor

Sound signal processing apparatuses and methods of operating the same are provided. The sound signal processing apparatus includes: a band separator configured to separate sound signals into frequency bands; an adder configured to add sound signals; and a signal processor that is arranged between the band separator and the adder and comprises a plurality of signal processing blocks. The band separator includes elements for separating the sound signals into frequency bands, and the elements correspond one to one to the signal processing blocks.

Growing community of inventors

Seoul, South Korea

Yongseop Yoon