Samsung Electronics Co., Ltd.

Yongseong Kim

Dongki Min

Dahee Lee

Wooseok Choi

Jiyeon Han

Chansik Kwon

Jinduck Park

Youngmi Jo

Inwook Im

A semiconductor chip includes a semiconductor substrate including a device region, and an edge region surrounding the device region, a device layer on the semiconductor substrate, a wiring layer on the device layer, a side surface of the wiring layer at least partially defining a recessed region that is in the edge region such that the side surface of the wiring layer is exposed by the recessed region, and an upper insulating layer on the wiring layer. The recessed region extends from a side surface of the device layer toward the device region. A first portion of the upper insulating layer covers the side surface of the wiring layer that is exposed by the recessed region.

Semiconductor chips having recessed regions

An image sensor including a pixel array including a plurality of sub-pixels arranged along a plurality of rows and a plurality of columns, and k number of sub-pixels representing one color pixel in conjunction with each other, where k is an integer equal to or greater than four and calibration circuitry may be provided. The calibration circuitry may be configured to receive digital image signal generated based on pixel signals output from the pixel array, calculate a color gain of the digital image signal based on a coefficient set calculated based on a reference image signal generated by a reference image sensor under a first light source having a first color temperature, store coefficient sets associated with a plurality of color temperatures including the first color temperature, and apply the color gain to the digital image signal to generate a calibrated image signal.

Calibration module of image sensor, image sensor and method of calibrating crosstalk in image sensor

Growing community of inventors

Suwon-si, South Korea

Yongseong Kim