Seagate Technology Incorporated

Western Digital Technologies, Inc.

Western Digital (fremont), Inc.

Yongping Gong

Krisda Siangchaew

Phuwanai Bunnak

Kah Choong Loo

Kristoffer Steven Scheponik

Joel William Hoehn

Alexander V Demtchouk

Budi Suswadi

Fang Chen

A method of providing an apparatus with a protective layer by simultaneously depositing carbon and seed material on the apparatus to form an intermediate layer, wherein the carbon and seed material have a percentage composition that varies as a function of the intermediate layer thickness; and then providing a diamond-like carbon (DLC) layer adjacent to the intermediate layer to produce the protective layer.

System and method for providing a protective layer having a graded intermediate layer

Systems and methods for tuning seed layer hardness in components of magnetic recording systems are described. One such system includes a substrate including a component of a magnetic recording system, a first deposition source configured to deposit a seed layer material on a portion of a top surface of the substrate at a first angle, and a second deposition source configured to deposit a carbon material including sp3 carbon bonds on the portion of the top surface at a second angle not equal to the first angle, where the first deposition source and the second deposition source deposit the seed layer material and the carbon material, respectively, simultaneously. The component can be a slider or a magnetic medium.

Slider for magnetic recording system

Systems and methods for tuning seed layer hardness in components of magnetic recording systems

A structure includes a substrate, a metallization layer on the substrate, and a cap layer on the metallization layer, wherein the cap layer includes a cap platinum (Pt) layer on the metallization layer, and a cap gold (Au) layer deposited on the Pt cap layer. A method of bonding a laser diode submount assembly to a hard disk assembly slider includes disposing a first metallization layer on the slider, disposing a cap layer on the first metallization layer, wherein the cap layer includes a cap Pt layer on the first metallization layer, and a cap Au layer deposited on the cap Pt layer, disposing a second metallization layer on the laser diode submount assembly, and forming a solder bond between the cap layer on the slider and the second metallization layer on the laser diode submount assembly.

Integrated heat-assisted magnetic recording head/laser assembly

A protecting coating for a copper substrate is disclosed. The coating comprises seed layer comprising titanium ions that forms an 'alloy-like' structure with the copper substrate. The coating further comprises a first layer of carbon disposed on the seed layer comprising titanium ions. A second layer comprising titanium is disposed on the first layer of carbon, and a second layer of carbon is disposed on the second layer comprising titanium.

Corrosion resistant coating for copper substrate

An apparatus includes a metal substrate, an amorphous adhesion layer on the metal substrate, and a protective DLC layer over the adhesion layer. The adhesion layer has a thickness of less than about 8 Angstroms, and has a composition of carbon silicon carbide or carbon silicon nitride. The composition of the adhesion layer provides corrosion resistance for the metal substrate.

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Eagan, MN, United States of America

Yongping Gong