Innovium, Inc.

Cisco Technology, Inc.

Yongming Xiong

Lin Shen

Shahbaz Mahmood

Vittal Balasubramanian

Keith Michael Ring

Maurilio Tazio De Nicolo

Stephen S Ong

In a circuit fabrication method, first, second, and third initial vias are fabricated in a circuit board. First and second conductive traces are fabricated at first and second depths in the circuit board. Either a first indication is obtained that, in a final circuit configuration, an integrated circuit is to be directly electrically connected to a first circuit element without directly electrically connecting to a second circuit element, or a second indication is obtained that, in the final circuit configuration, the integrated circuit is to be directly electrically connected to the second circuit element without directly electrically connecting to the first circuit element. In response to obtaining the first indication, a first portion of the second initial via is removed by drilling. In response to obtaining the second indication, a second portion of the second initial via is removed by drilling.

Circuit fabrication method that includes reconfiguration of via connections between circuit elements

Loss reduction methods are described. A first transmission loss associated with signal transmission through a trace in a first circuit board design is determined. The trace is routed from an integrated circuit disposed on a circuit board to a circuit element disposed on the circuit board. It is determined that the first transmission loss is greater than a threshold transmission loss. The first circuit board design is altered to obtain a second circuit board design. In the second circuit board design, the trace is routed from the integrated circuit to a connector disposed on the circuit board, and the connector is electrically coupled to the circuit element by a cable. A second transmission loss associated with signal transmission between the integrated circuit and the circuit element in the second circuit board design is less than the threshold transmission loss.

Reconfigurable circuit devices

A circuit system includes a circuit board. An integrated circuit is mounted on the circuit board, the integrated circuit including a plurality of pins. A trace-to-cable connector is mounted on the circuit board, the trace-to-cable connector configured to couple to a first cable of a first cable-type. A cable-to-cable connector is mounted on the circuit board, the cable-to-cable connector configured to couple the first cable to a second cable of a second cable-type. A first plurality of metal traces couple a first subset of the plurality of pins to the trace-to-cable connector.

Circuit board devices with reconfigurable connections

The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.

Techniques for optimizing dual track routing

An apparatus comprising a printed circuit board (PCB) that includes: a multilayer lamination of layers; vias on a surface of the PCB; and bonding pads that couple a ball grid array of an integrated circuit (IC) package to layers through the vias, wherein the bonding pads includes: first bonding pads in a first area of the PCB, each first bonding pad being coupled to a via of the vias in the first area, second bonding pads arranged in a second area of the PCB, each second bonding pad being coupled to a via of the vias in the second area, and third bonding pads arranged in a third area of the PCB, each third bonding pad being coupled to two or more vias of the vias in the third area, wherein the third area is located between the first area and the second area is disclosed.

Printed circuit board and integrated circuit package

A method and apparatus for matching the lengths of traces of differential signal pairs. The method includes determining that a first trace is longer than a second trace and modifying the second trace so that the length is substantially equal to the length of the first trace. In some implementations, the second trace can be modified by replacing one or more sections of the trace with two line segments that are substantially equal in length and meet at a vertex that is less than 180 degrees.

Triangular routing for high speed differential pair length matching

A printed circuit board having multiple layers of circuitry, the printed circuit board including a first layer having a first cylindrical opening with a first diameter, the first cylindrical opening formed through at least the first layer and formed about a particular axis; and a second layer having a second cylindrical opening with a second diameter, the second cylindrical opening formed through at least the second layer and formed about the particular axis, where the first cylindrical opening is a portion of a conductive via, and where the second diameter is smaller than the first diameter.

Dual-drill printed circuit board via

An apparatus that includes: a printed circuit board (PCB) that includes: a multilayer lamination of one or more ground layers, one or more power layers, and multiple signal layers; multiple vias that pass through one or more layers of the multilayer lamination, wherein a first via of the multiple vias includes: a first portion that has a first diameter, and a second portion that has a second diameter that is smaller than the first diameter, wherein a second via of the multiple vias includes: a third portion that has a third diameter, and a fourth portion that has a fourth diameter that is smaller from the third diameter; and wherein the first portion of the first via is adjacent to the fourth portion of the second via and the second portion of the first via is adjacent to the third portion of the second via is disclosed.

Printed circuit board including multi-diameter vias

The subject technology provides configurations for a printed circuit board that includes a first reference plane, a first signal layer below the first reference plane, a second signal layer below the first signal layer, a second reference plane below the second signal layer, a first differential pair on the first signal layer, and a second differential pair on the second signal layer, each of the first and second differential pairs comprising, respectively, a first pair and a second pair of conductive traces formed on a dielectric material of the PCB, the first pair of conductive traces being arranged on the dielectric material to interleave with the second pair of conductive traces.

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Fremont, CA, United States of America

Yongming Xiong