Intel Corporation

Yongmei Liu

Peng T Li

Sergio Antonio Chan Arguedas

Deepak Goyal

Rajen C Dias

Ken P Hackenberg

Manish Dubey

Kelly P Lofgreen

Bamidele Daniel Falola

Shenavia S Howell

Embodiments may relate to a microelectronic package that includes a lid coupled with a package substrate such that a die is positioned between the lid and the package substrate. The lid may include a heating element that is to heat an area between the lid and the die. Other embodiments may be described or claimed.

Integrated heat spreader (IHS) with heating element

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate having a first surface and an opposing second surface; a die having a first surface and an opposing second surface, wherein the first surface of the die is coupled to the second surface of the package substrate; a cooling apparatus thermally coupled to the second surface of the die; and a thermal interface material (TIM) between the second surface of the die and the cooling apparatus, wherein the TIM includes an indium alloy having a liquidus temperature equal to or greater than about 245 degrees Celsius.

Microelectronic assemblies including a thermal interface material

An apparatus and system, as well as fabrication methods therefor, may include a unitary, substantially uniformly distributed transfer material coupled to a carrier material.

Thermal interface apparatus, systems, and fabrication methods

Growing community of inventors

Gilbert, AZ, United States of America

Yongmei Liu