Sandisk Technologies Inc.

Yonglong Liu

Paul Qu

Shixing Zhu

Vincent Jiang

Yuanheng Zhang

Enoch He

Lian Chen

Virgil Zhu

Guangqiang Li

Jingyun Chen

A method of soldering one or more components to a substrate includes providing a substrate and applying an amount of solder material to the top planar surface of the substrate. One or more electrical components are mounted to the solder material in a predetermined position and orientation. A carrier is provided having one or more magnets embedded therein. The substrate is positioned above the carrier such that each of the one or more magnets is positioned directly below a corresponding electrical component. A carrier cover is positioned above the substrate and the electrical components. The solder material is heated to a predetermined temperature for a predetermined amount of time during which each of the magnets exerts a magnetic force on a corresponding electrical component to maintain its orientation relative to the substrate. The magnets reduce the occurrence of tombstoning of the electrical components during heating of the solder material.

Surface mount technology method and magnetic carrier system

Growing community of inventors

Shanghai, China

Yonglong Liu