University of Southern California

Yongkui Tang

Eun Sok Kim

Jiang F Zhong

Xuelian Chen

A device for picking and placing semiconductor chips includes a liquid having a first surface and a second surface and a layer of semiconductor chips disposed over the first surface. Characteristically, the first surface is a liquid-air interface. The device also includes a focused ultrasonic transducer positioned to focus acoustic wave on the layer of semiconductor chips such that a droplet including at least one semiconductor chip is ejected through the liquid-air per each actuation of the focused ultrasonic transducer through droplet ejection. The focused ultrasonic transducer includes a piezoelectric substrate having a top face and a bottom face, a Fresnel acoustic lens including a plurality of annular rings of air cavities disposed on the top face, and a first patterned circular electrode disposed over the top face and a second patterned circular electrode disposed over the bottom face. The first patterned circular electrode overlaps the second patterned circular electrode.

Pick and placement of semiconductor chips based on nozzleless self-focusing acoustic droplet ejector

A device for contactless, damage-free, high-precision cell and/or particle extraction and transfer through acoustic droplet ejection includes a substrate having a first surface and a second surface and a focused ultrasonic transducer positioned to focus an acoustic wave onto the substrate such that a droplet that includes at least one cell or particle is ejected from the bulk or from the first surface per each actuation of the focused ultrasonic transducer through droplet ejection. The substrate includes cells or particles inside the substrate or on top of the substrate. The focused ultrasonic transducer includes a piezoelectric substrate having a top face and a bottom face, a Fresnel acoustic lens including a plurality of annular rings of air cavities disposed on the top face, and a first patterned circular electrode disposed over the top face and a second patterned circular electrode disposed over the bottom face. The first patterned circular electrode overlaps the second patterned circular electrode.

Growing community of inventors

Pasadena, CA, United States of America

Yongkui Tang