Samsung Electronics Co., Ltd.

Yongjin Shin

Ik Soo Kim

Kyoung-Hee Kim

Jinsub Kim

Jun Kwan Kim

Woo Choel Noh

Sunyoung Kim

Sungwon Park

Younghun Seong

An electronic device is provided. The electronic device includes a housing, and a flexible connecting member disposed inside the housing, the flexible connecting member including a dielectric substrate, at least one signal wire disposed on one surface of the dielectric substrate, and at least one ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The at least one signal wire and the at least one ground is disposed to be spaced apart from each other when viewed from above the dielectric substrate. A flexible connecting member includes a dielectric substrate, a signal wire disposed on one surface of the dielectric substrate, and a ground disposed on the other surface of the dielectric substrate adjacent to the signal wire. The signal wire and the ground are disposed to be spaced apart from each other when viewed from above the dielectric substrate.

Flexible connecting member and electronic device including same

A semiconductor device including a substrate that includes a cell array region and a peripheral circuit region; a cell transistor on the cell array region of the substrate; a peripheral transistor on the peripheral circuit region of the substrate; a first interconnection layer connected to the cell transistor; a second interconnection layer connected to the peripheral transistor; an interlayer dielectric layer covering the first interconnection layer; and a blocking layer spaced apart from the first interconnection layer, the blocking layer covering a top surface and a sidewall of the second interconnection layer.

Semiconductor device

Semiconductor device and method of fabricating the same

Growing community of inventors

Yongin-si, South Korea

Yongjin Shin