Samsung Electronics Co., Ltd.

Samsung Sdi Co., Inc.

Lg Electronics Inc.

Yongjin Park

Myungsam Kang

Jong-Ha Lee

Byongchul Woo

Heejung Ko

Kijung Kim

Youngchan Ko

Seonho Lee

Won Suk Choi

Jinsu Kim

Minhyung Guen

Yonghwan Kwon

Jaekul Lee

Sunghawn Bae

Junwoo Myung

Minook Kim

Taegil Cho

Gyuhwan Oh

Younggwan Ko

Jinho Sohn

Jin-San Jung

Jinwook Yang

Jiyoon Chung

Jungkwan Son

Tacksung Choi

Sewan Gu

Junhwan Paik

Taeweon Heo

Jinsan Jung

Jiin Yu

A semiconductor package includes a first redistribution structure, including a first insulating layer and a first redistribution layer disposed below the first insulating layer; a semiconductor chip disposed on the first redistribution structure, including a connection terminal electrically connected to the first redistribution layer and buried in the first insulating layer; an encapsulant disposed on the first redistribution structure that seals a portion of the semiconductor chip; a second redistribution structure, including a second redistribution layer disposed on the encapsulant; and a through via, including a pattern portion buried in the first insulating layer and electrically connected to the first redistribution layer and a via portion penetrating through the encapsulant and electrically connecting the pattern portion and the second redistribution layer. The connection terminal and the pattern portion are located at a first level and are electrically connected to each other at a second level lower than the first level.

Semiconductor package and method for manufacturing semiconductor package

A rechargeable battery includes: a case receiving an electrode assembly and including an opening; a cap assembly including a cap plate coupled to the case and covering the opening, and a terminal plate coupled to the cap plate; and a housing covering the cap plate and coupled to the case, and an outer surface of the terminal plate protrudes more than an outer surface of the housing to have a height difference.

Button cell

A semiconductor device including a semiconductor chip having a first surface and a second surface opposite to the first surface, a first heat dissipation member on the second surface of the semiconductor chip, the first heat dissipation member having a vertical thermal conductivity in a direction perpendicular to the second surface, and a horizontal thermal conductivity in a direction parallel to the second surface, the first vertical thermal conductivity being smaller than the first horizontal thermal conductivity, and a second heat dissipation member comprising a vertical pattern penetrating the first heat dissipation member, the second heat dissipation member having a vertical thermal conductivity that is greater than the vertical thermal conductivity of the first heat dissipation member may be provided.

Semiconductor device and semiconductor package having the same

A rechargeable battery includes: an electrode assembly including a first electrode, a second electrode, and a separator between the first electrode and the second electrode; a case configured to be connected to the first electrode to accommodate the electrode assembly, and including an opening to receive the electrode assembly; a cap plate configured to be coupled with the case to cover an outer area of the opening, and including a through-hole to expose a central area of the opening; and a terminal plate configured to be connected to the second electrode and to be insulation-bonded to the cap plate, and including a flange portion covering the through-hole, and a protrusion penetrating the through-hole from the flange portion.

A fan-out type semiconductor package may include a frame, an upper chip stack, a first redistribution pattern, a lower chip stack, a second redistribution pattern and a redistribution post. The frame may have a cavity. The upper chip stack may be arranged in the cavity. The first redistribution pattern may be arranged under the frame. The first redistribution pattern may be electrically connected with the upper chip stack. The lower chip stack may be arranged under the first redistribution pattern. The second redistribution pattern may be arranged under the lower chip stack. The second redistribution pattern may be electrically connected with the lower chip stack. The redistribution post may be electrically connected between the first redistribution pattern and the second redistribution pattern. Thus, the fan-out type semiconductor package may have an improved heat dissipation characteristic with a thin thickness.

Fan-out type semiconductor package and method of manufacturing the same

A semiconductor package includes: a redistribution substrate; a frame including first and second vertical connection conductors, and having a through-hole; first and second semiconductor chips; an encapsulant; a second redistribution structure disposed on the encapsulant, a conductive wire electrically connecting the second semiconductor chip and the second vertical connection conductor; and a vertical connection via penetrating a portion of the encapsulant, and electrically connecting the second redistribution structure and the first vertical connection conductor. The first semiconductor chip is connected to the second vertical connection conductor by the first redistribution structure.

Semiconductor package

A package module includes a connection structure including one or more redistribution layers, a semiconductor chip disposed on the connection structure and having a connection pad electrically connected to the one or more redistribution layers, a plurality of electronic components disposed on the connection structure and electrically connected to the one or more redistribution layers, one or more frames disposed on the connection structure, and an encapsulant disposed on the connection structure, and respectively covering at least portions of the semiconductor chip, the plurality of electronic components, and the one or more frames. At least a portion of an outer side surface of the encapsulant is coplanar on the same level as at least a portion of an outer side surface of at least one of the one or more frames.

Package module

A semiconductor package includes; a semiconductor chip including a top surface and an opposing bottom surface, a heat dissipation structure including a lower adhesive layer adhered to the top surface of the semiconductor chip, a heat dissipation layer disposed on the lower adhesive layer, and a conductive layer disposed on the heat dissipation layer, a core layer including a cavity and a lower surface, wherein a combination of the semiconductor chip and the heat dissipation structure is disposed within the cavity, and a bottom re-wiring layer including a bottom re-wiring line connected to the semiconductor chip.

Semiconductor package including heat dissipation structure

A rechargeable battery includes: an electrode assembly including a first electrode, a second electrode, and a separator between the first electrode and the second electrode; a case including an inner space accommodating the electrode assembly, and an opening; a cap plate coupled to the case at the opening and including a terminal hole exposing the inner space; an electrode terminal electrically connected to the electrode assembly through the terminal hole and overlapping the cap plate; electrode tabs respectively connected to the first electrode and the second electrode; and an electrolyte solution in the inner space, and at least one electrode tab of the electrode tabs has an inclined portion that is inclined at a first angle with respect to a surface of the electrode assembly facing the at least one electrode tab.

Rechargeable battery

A rechargeable battery includes: an electrode assembly including a first electrode, a second electrode, and a separator between the first electrode and the second electrode; a case configured to be connected to the first electrode and accommodate the electrode assembly, and including an opening to expose the electrode assembly; a cap plate configured to be coupled to the case to cover an outer area of the opening, and including a through-hole to expose a central area of the opening; a terminal plate configured to cover the through-hole and to be connected to the second electrode; and a thermal-fusion layer configured to be arranged between the cap plate and the terminal plate and to insulation-bond the cap plate and the terminal plate, and the thermal-fusion layer includes a plurality of layers including a thermoplastic resin layer.

A rechargeable battery includes: an electrode assembly including a first electrode, a second electrode, and a separator between the first electrode and the second electrode; a case connected to the first electrode and accommodating the electrode assembly, the case including an opening to receive the electrode assembly; a cap plate bonded to the case to cover an outer region of the opening and including a through-hole to expose a center region of the opening; a terminal plate bonded to and insulated from the cap plate, covering the through-hole, and connected to the second electrode; and a terminal plating layer coated on an upper surface of the terminal plate, and a thickness of a center portion of the terminal plating layer overlapping the through-hole is thicker than a thickness of an outer portion of the terminal plating layer overlapping the upper surface of the terminal plate.

A semiconductor package includes an interconnect structure having a first surface and a second surface opposing the first surface, and including a redistribution pattern and a vertical connection conductor, a first semiconductor chip disposed for a first inactive surface to oppose the first surface, a second semiconductor chip disposed on the first surface of the interconnect structure and disposed for the second inactive surface to oppose the first surface; a first encapsulant encapsulating the first and second semiconductor chips, a backside wiring layer disposed on the first encapsulant, a wiring structure connecting the redistribution pattern to the backside wiring layer, a heat dissipation member disposed on the second surface and connected to the vertical connection conductor.

System in package (SiP) semiconductor package

A semiconductor package may include a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, and an adhesive layer between the first semiconductor chip and the second semiconductor chip. The first semiconductor chip may include a semiconductor substrate and a plurality of protection layers on the semiconductor substrate. The topmost layer of the protection layers may have a top surface with convex portions and concave portions, and the convex portions and the concave portions may be in contact with the adhesive layer.

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Yongin-si, South Korea

Yongjin Park