Hitachi Global Storage Technologies Netherlands B.v.

Hgst Netherlands, B.v.

Hitachi Global Storage Technologies Amsterdam B.v.

Yongjian Sun

Cherngye Hwang

Eric Wayne Flint

Pei Cheh Chen

Brian Rodrick York

Jila Tabib

Diana Perez

Jorge Goitia

Peter Dang

Bigal Leung

Laurence S Samuelson

Daryl J Pocker

Nobuto Yasui

Tetsuya Matsusaki

Eduardo Torres Mireles

Charanjit S Bhatia

Omar Eduardo Montero Camacho

Omar E Montero Camacho

Roberto Cabral Frias

Mario Garcia De La Cruz

A method for reducing the height of a defect associated with an air bearing surface of a hard disk drive slider is disclosed. The technology initially ion mills for a first period of time at a first angle relative to an air bearing surface of a disk drive slider to remove a first portion of the air bearing surface. Then the technology ion mills for a second period of time at a second angle relative to an air bearing surface of the disk drive slider to remove a second portion of the air bearing surface. The second portion of the air bearing surface comprises a defect wherein the ion milling at the second angle reduces the height of the defect with respect to the air bearing surface.

Reducing the height of a defect associated with an air bearing surface

A system in one embodiment includes a magnetic sensor having a free magnetic layer, a nanocrystalline seed layer formed on an insulative amorphous material; a chromium-containing underlayer formed on the seed layer; and a hard bias layer formed on the underlayer and separated from the sensor by the insulative amorphous material. A method according to a further embodiment includes forming an amorphous insulative layer encapsulating a sensor stack; forming a nanocrystalline seed layer on the amorphous insulative material; forming a chromium-containing underlayer on the seed layer; and forming a hard bias layer on the underlayer. Additional systems and methods are presented.

Read sensors with improved orientation of the hard bias layer and having a nanocrystalline seed layer

An assembly, apparatus and method for fabricating a structural element of a hard disk drive air bearing. The method and apparatus provide an improved protective layer, an improved structural element consisting of a single layer of structural material, and a method consisting of applying the improved protective layer, applying a uniform layer of structural material, applying a resist layer, etching the structural material layer, and removing the resist layer.

Assembly, apparatus and method for fabricating a structural element of a hard disk drive air bearing

A hard disk drive slider comprises an overcoat layer, which covers an air-bearing surface of the slider. The overcoat covers an exposed surface of a tunneling magnetoresistance transducer. An adhesion layer is coupled with the overcoat layer and the air-bearing surface. The adhesion layer comprises a compound of nitrogen. The compound of nitrogen reduces noise in read data from the tunneling magnetoresistance transducer.

Slider overcoat for noise reduction of TMR magnetic transducer

Insulator barrier for noise reduction of a TMR magnetic transducer

A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.

Method and apparatus for increasing uniformity in ion mill process

Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.

Direct cooling pallet assembly for temperature stability for deep ion mill etch process

Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.

Direct cooling pallet tray for temperature stability for deep ion mill etch process

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San Jose, CA, United States of America

Yongjian Sun