Samsung Electronics Co., Ltd.

Yongin Lee

Hyuk Jae Lee

Doogie Lee

Seunghyun Choi

Sang-Yoon Kim

YoungBum Kim

Hui-Jae Kim

Byungjoon Lee

Jaeyeon Pyo

SeungDae Seok

Joong-Ha Lee

Jaebong Shin

A storage device includes a solid state drive (SSD), a field programmable gate array (FPGA), a power sensor and a global controller. The SSD stores data and receives power through a power rail connected to a host device. The FPGA processes data read from the SSD or data to be stored in the SSD and receives power through the power rail. The power sensor is connected to the power rail and generates a measured power value corresponding to a total power consumed by the SSD and the FPGA by measuring the total power. The global controller determines one of the SSD and the FPGA as a priority component operating with a fixed performance and determines the other of the SSD and the FPGA as a non-priority component operating with a variable performance in a priority mode based on power control information provided from the host device.

Storage device, multi-component device and method of controlling operation of the same

A storage device set is provided. The storage device set includes a reconfigurable logic chip and a storage device. The logic chip includes a retimer configured to generate an output signal by adjusting an input signal received from an external device; and an operation circuit configured to perform an operation function. The storage device includes: a first port connected to the retimer; a second port connected to the operation circuit; and a controller configured to control data transmission and reception via the first port and the second port.

Storage device set including storage device and reconfigurable logic chip, and storage system including the storage device set

A bonding apparatus includes a stage supporting a substrate, a first bonding head at a first side of the stage, the first bonding head to pick up a first chip and to bond the picked-up first chip onto the substrate, a second bonding head at a second side of the stage, the second bonding head to pick up a second chip and to bond the picked-up second chip onto the substrate, and a first image acquisition unit over a movement path of the stage to acquire an image of the stage.

Bonding apparatus

Growing community of inventors

Suwon-si, South Korea

Yongin Lee