Samsung Electronics Co., Ltd.

Yonghyun Kim

Seunghwan Kim

Jongho Park

Yongkwan Lee

Junyoung Oh

Junga Lee

A semiconductor package includes a first package substrate; a first semiconductor chip on the first package substrate; a first conductive connector on the first package substrate; and an interposer including a central portion on the first semiconductor chip and an outer portion having the first conductive connector attached thereto. The central portion of the interposer includes a bottom surface defining a recess from a bottom surface of the outer portion of the interposer in a vertical direction that is perpendicular to a top surface of the first package substrate. A thickness in the vertical direction of the outer portion of the interposer is greater than a thickness in the vertical direction of the central portion of the interposer.

Growing community of inventors

Asan-si, South Korea

Yonghyun Kim