Samsung Electronics Co., Ltd.

Yonghyuk Choi

Bongsoon Lim

Jaeduk Yu

Sangwan Nam

Sang-won Shim

Sangwon Park

Yohan Lee

Hongsoo Jeon

Sang-Wan Nam

Sang-Won Park

Kang-Bin Lee

Jae-Duk Yu

Daeseok Byeon

Hyun Seok Seo

Joonsuc Jang

Sangsoo Park

Jiho Cho

Kihoon Kang

Sungmin Joe

Seungbum Kim

Seungyong Choi

A memory device comprises: a memory cell array including a plurality of cell blocks including a first cell block storing information other than user data and a second cell block storing the user data, wherein each of the plurality of cell blocks includes a plurality of cell strings and control circuitry configured to control a write operation and a read operation of the memory cell array. A first ground select line (GSL) region included in the first cell block includes a plurality of GSLs stacked in a vertical direction. One or more ground select transistors of a plurality of ground select transistors connected to each of the GSLs are programmed to a first threshold voltage and the other ground select transistors of the plurality of ground select transistors not connected to the GSLs are programmed to a second threshold voltage that is higher than the first threshold voltage. A first line included in the first GSL region in the first cell block is arranged at a same height as a word line connected to memory cells storing the user data in the second cell block.

Memory device and operating method thereof

A memory device includes first and second semiconductor layers. The first semiconductor layer includes wordlines and bitlines, an upper substrate, and a memory cell array. The memory cell array includes a memory blocks. The second semiconductor layer includes a lower substrate, and an address decoder. Each memory block includes a core region including a memory cells, a first extension region adjacent to a first side of the core region and including a plurality of wordline contacts, and a second extension region adjacent to a second side of the core region and including an insulating mold structure. The second extension region includes step zones and at least one flat zone. Through-hole vias penetrating the insulating mold structure are in the flat zone. The wordlines and the address decoder are electrically connected with each other by at least the through-hole vias.

Memory devices having cell over periphery structure, memory packages including the same, and methods of manufacturing the same

An operating method of a non-volatile memory device that includes a plurality of cell strings each including a first stack and a second stack adjacent to the first stack, the operating method include performing a first program operation during a time period in which a plurality of program loops are performed, by applying a program voltage including a first plurality of voltage levels to a select word line connected to the first stack of each of the plurality of cell strings, applying, during the time period, second voltages including a second plurality of voltage levels to a non-select word line connected to the first stack of each of the plurality of cell strings, and maintaining, during the time period, a third voltage at a first level, the third voltage applied to a non-select word line connected to the second stack of each of the plurality of cell strings.

Non-volatile memory device and programming method thereof

A nonvolatile memory device having a multi-stack memory block includes: a memory cell array divided into a plurality of memory stacks disposed in a vertical direction; and a control circuit configured to perform a channel voltage equalization operation of the plurality of memory stacks, wherein inter-stack portions are between the plurality of memory stacks, and a channel hole passes through the word lines of each of the plurality of memory stacks. The control circuit determines, as inter-stack word lines, some word lines adjacent to the inter-stack portions among the word lines of each of the plurality of memory stacks and differently controls setup time points for applying a pass voltage, or recovery time points for applying a ground voltage, to the inter-stack word lines, according to sizes of the channel hole of the inter-stack word lines.

Nonvolatile memory device having multi-stack memory block and method of operating the same

Provided is a non-volatile memory device including a memory cell array including cell strings each including memory cells and a string select transistor connected to a string select line; a page buffer circuit including page buffers each including a forcing latch configured to store forcing information; and a control logic circuit configured to, during a program operation on a selected word line, control at least two of a first voltage applied to the string select line in a first interval before a bit line forcing operation for transferring the forcing information to the selected cell string, a second voltage applied to the string select line in a second interval in which the bit line forcing operation is performed, and a third voltage applied to the string select line in a third interval after the bit line forcing operation is performed, to be different from each other.

Non-volatile memory device

A nonvolatile memory device includes at least one memory block and a control circuit. The at least one memory block includes a plurality of cell strings, each including a string selection transistor, a plurality of memory cells and a ground selection transistor. The control circuit controls a program operation by precharging channels of the plurality of cell strings to a first voltage during a bit-line set-up period of a program loop, applying a program voltage to a selected word-line of the plurality of cell strings during a program execution period of the program loop and after recovering voltages of the selected word-line and unselected word-lines of the plurality of cell strings to a negative voltage smaller than a ground voltage, recovering the voltages of the selected word-line and the unselected word-lines to a second voltage greater than the ground voltage during a recovery period of the program loop.

Nonvolatile memory device and method of programming in a nonvolatile memory

A three-dimensional semiconductor memory device may include a first stack structure block including first stack structures arranged in a first direction on a substrate, a second stack structure block including second stack structures arranged in the first direction on the substrate, a separation structure disposed on the substrate between the first and second stack structure blocks and including first mold layers and second mold layers, and a contact plug penetrating the separation structure. A bottom surface of the contact plug may contact the substrate.

Three-dimensional semiconductor memory device

A memory device, a memory system, and/or a method of operating a memory system includes measuring, using processing circuitry, an erase program interval (EPI) of a memory group included in a non-volatile memory (NVM), the EPI being a time period from an erase time point to a program time point of the memory group, determining, using the processing circuitry, a plurality of program modes based on a number of data bits stored in each memory cell of the memory group, selecting, using the processing circuitry, a program mode for the memory group from the plurality of program modes, based on the measured EPI of the memory group, and performing, using the processing circuitry, a program operation on the memory group corresponding to the selected program mode.

Memory system and method of operating the same

A nonvolatile memory device includes a first semiconductor layer, a second semiconductor layer and a control circuit. The memory cell array includes a first vertical structure on the first upper substrate and a second vertical structure on the second upper substrate, the first vertical structure includes first sub-blocks and the second vertical structure includes second sub-blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The first vertical structure includes first via areas in which one or more through-hole vias are provided, through-hole vias pass through the first vertical structure. The first sub-blocks are arranged among the first via areas and the second sub-blocks are arranged among the second via areas. The control circuit groups the memory blocks into a plurality of groups based on whether the memory blocks is close to the first via areas and performs address re-mapping.

Nonvolatile memory device having cell-over-periphery (COP) structure with address re-mapping

Each of memory blocks of a nonvolatile memory device includes a memory cell region including first metal pads, first memory cells of a first portion of pillar, and second memory cells of a second portion of the pillar, and a peripheral circuit region including second metal pads, a row decoder, and a page buffer. When performing program operations based on consecutive addresses at a memory block selected from the memory blocks, the nonvolatile memory device sequentially completes first program operations of non-adjacent memory cells not adjacent to a boundary of the first portion and the second portion from among the first and second memory cells and then completes a second program operation of an adjacent memory cell adjacent to the boundary. The peripheral circuit region is vertically connected to the memory cell region by the first metal pads and the second metal pads directly.

Nonvolatile memory device, storage device, and operating method of nonvolatile memory device

A nonvolatile memory device includes a first semiconductor layer including an upper substrate in which word-lines extending in a first direction and bit-lines extending in a second direction are disposed and a memory cell array, a second semiconductor layer, a control circuit, and a pad region. The memory cell array includes a vertical structure on the upper substrate, and the vertical structure includes memory blocks. The second semiconductor layer includes a lower substrate that includes address decoders and page buffer circuits. The vertical structure includes via areas in which one or more through-hole vias are provided, and the via areas are spaced apart in the second direction. The memory cell array includes mats corresponding to different bit-lines of the bit-lines. At least two of the mats include a different number of the via areas according to a distance from the pad region in the first direction.

Nonvolatile memory device

A three-dimensional semiconductor memory device may include a peripheral circuit structure including transistors on a first substrate, and a cell array structure on the peripheral circuit structure, the cell array structure including: a first stack structure block comprising first stack structures arranged side by side in a first direction on a second substrate, a second stack structure block comprising second stack structures arranged side by side in the first direction on the second substrate, a separation structure disposed on the second substrate between the first stack structure block and the second stack structure block and comprising first mold layers and second mold layers, and a contact plug penetrating the separation structure. The cell array structure may include a first metal pad and the peripheral circuit structure may include a second metal pad. The first metal pad may be in contact with the second metal pad.

A nonvolatile memory device includes memory cell region including a first metal pad and a peripheral circuit region including a second metal pad, is connected to the memory cell region by the first metal pad and the second metal pad and includes including an address decoder and a page buffer circuit located on a first substrate. A memory cell array is provided in the memory cell region, which includes a first vertical structure on a second substrate. The first vertical structure includes first sub-blocks and first via areas in which one or more through-hole vias are provided, and through-hole vias pass through the first vertical structure. A control circuit in the peripheral circuit region groups the memory blocks into a plurality of groups based on whether the memory blocks is close to the first via areas and performs address re-mapping.

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Suwon-si, South Korea

Yonghyuk Choi