Samsung Electronics Co., Ltd.

Hyundai Motor Company

Kia Motors Corporation

Kia Corporation

Postech Research and Business Development Foundation

Yonghoon Kim

Heeseok Lee

Keung Beum Kim

Yuichi Aoki

Inho Choi

Seung-Yong Cha

Hyeonjin Shin

Kyung-Eun Byun

Changseok Lee

Yeonchoo Cho

Keunwook Shin

Changhyun Kim

Hyunjae Song

Tuan Manh Dao

Daehyun Kang

Hyunjong Moon

Hyo-Soon Kang

Seongho Shin

Donggyu Minn

Yuntae Lee

Jaehyun Lim

Jihyun Lee

Kihyun Kim

Seung Hwan Kim

Jihoon Kim

Sang Jin Park

Dong Ho Chu

Yunseok Choi

Youngsik Hur

Hyunki Kim

Hyunchul Park

Eunseok Cho

Seyoung Lee

Youngchang Yoon

Soyoung Lim

Yoonha Jung

Hyuna Kim

Dongsuk Kim

Sunggi Yang

Youngkwan Lee

Sayoon Kang

Wonchul Lim

Taehee Han

Tongsuk Kim

PaLan Lee

Wonki Kim

Ho-Jin Song

Tai-Hyun Eum

Manh-Tuan Dao

Jin Won Hong

Sehyug Jeon

Hyundo Ryu

Jeeho Park

Won Chul Shin

Haewon Park

Seunguk Choi

Yongan Hwang

Seokhyeon Kim

Heedo Kang

Manh Tuan Dao

Manhtuan Dao

The present disclosure relates to a pre-5-Generation (5G) or 5G communication system to be provided for supporting higher data rates Beyond 4-Generation (4G) communication system such as Long Term Evolution (LTE). An electronic device, in a wireless communication system, may include: a processor, an antenna array, a plurality of first radio frequency (RF) paths related to a first stream, the first RF paths each including a transmit (TX) path and a receive (RX) path, and a plurality of second RF paths related to a second stream, the second RF paths each including a TX path and an RX path, and the processor may be configured to: generate a calibration signal for the antenna array, obtain characteristic information of the antenna array based on a phase difference or a gain difference between one TX path having the first stream and one RX path having the second stream obtained for each of measurement RF paths among the plurality of the first RF paths, and calibrate the plurality of the first RF paths based on the characteristic information.

Apparatus and method for error correction in wireless communication system

The present disclosure relates to a communication technique for merging, with an IoT technology, a 5G communication system for supporting a higher data transmission rate than a 4G system, and a system therefor. The present disclosure can be applied to intelligent services (for example, smart homes, smart buildings, smart cities, smart cars or connected cars, healthcare, digital education, retail businesses, security- and safety-related services, and the like) on the basis of a 5G communication technology and an IoT-related technology. The present disclosure discloses a method for calibration of a phased array antenna.

Method and apparatus for calibrating phased array antenna

A vehicle includes: a battery; a battery thermostat; at least one sensor; and a controller configured to determine a preheating temperature of the battery based on an outside temperature of the vehicle and a first state of charge of the battery, and control the battery thermostat based on the preheating temperature, the first state of charge being identified through the at least one sensor.

Vehicle and control method of adjusting preheating temperature of battery

The disclosure relates to an RFIC apparatus, and more particularly, to an RFIC circuit having a test circuit, a test apparatus, and a test method thereof. Further, the disclosure relates to a method for estimating or determining a DC gain using a test apparatus and an RF circuit in a DC/AC test stage, and detecting defects of the RF circuit based on the estimated or determined DC gain.

Method and apparatus for detecting circuit defects

Provided are an interconnect structure and an electronic device including the interconnect structure. The interconnect structure includes a dielectric layer including at least one trench, a conductive wiring filling an inside of the at least one trench, and a cap layer on at least one surface of the conductive wiring. The cap layer includes nanocrystalline graphene. The nanocrystalline includes nano-sized crystals.

Interconnect structure having nanocrystalline graphene cap layer and electronic device including the interconnect structure

A semiconductor package includes: a frame having a cavity and including a wiring structure connecting first and second surfaces of the frame; a first connection structure on the first surface of the frame and including a first redistribution layer connected to the wiring structure; a first semiconductor chip on the first connection structure within the cavity; an encapsulant encapsulating the first semiconductor chip and covering the second surface of the frame; a second connection structure including a second redistribution layer including a first redistribution pattern and first connection vias; and a second semiconductor chip disposed on the second connection structure and having connection pads connected to the second redistribution layer.

Semiconductor package having a redistribution layer for package-on-package structure

The present disclosure relates to a pre-5-Generation (5G) or 5G communication system to be provided for supporting higher data rates beyond 4-Generation (4G) communication system such as long-term evolution (LTE). The present disclosure provides a device and a method for calibrating a phased array antenna. A method for calibrating a phased array antenna according to various embodiments of the disclosure comprises the processes of: controlling a first radio frequency (RF) chain so as to transmit a first signal at a first phase, thereby determining the phase difference between the first phase and a reference phase; controlling the first RF chain so as to transmit a second signal at a second phase, thereby determining the phase condition of the phase difference; and calibrating the first RF chain on the basis of the phase difference and the phase condition. The reference phase may be the phase of a reference signal transmitted from a reference RF chain. Accordingly, the time necessary for calibration may be reduced, and mass production of phased array antennas may be facilitated. The present research has been financed by the Korean government (Ministry of Science and ICT) in 2017 and conducted with the support of 'Intra-ministry Giga Korean Project' (No. GK17N0100, Millimeter-wave 5G Mobile Communication System Development).

Device and method for calibrating phased array antenna

Provided is a semiconductor package including a package structure including a base connection member including a redistribution layer, a first semiconductor chip including a plurality of first connection pads connected to the redistribution layer, an encapsulant disposed on the base connection member and covering at least a portion of the first semiconductor chip, and a backside connection member disposed on the encapsulant and including a backside wiring layer electrically connected to the redistribution layer, and a second semiconductor chip disposed on the base connection member or the backside connection member, the second semiconductor chip including a plurality of second connection pads connected to the redistribution layer or the backside wiring layer, the second semiconductor chip including a logic circuit, the first semiconductor chip including a logic input and output terminals that are connected to the logic circuit through at least one of the redistribution layer and the backside wiring layer.

Semiconductor package including multiple semiconductor chips

Provided are a radio frequency (RF) signal transmission apparatus and a control method of the RF signal transmission apparatus, in which a local oscillator (LO) leakage signal may be suppressed. The RF signal transmission apparatus may perform beamforming to form a beam based on a plurality of RF signals generated in a plurality of transmission chains, measure magnitude of an LO leakage signal of the beam formed by performing beamforming, and generate an LO leakage suppression signal based on the magnitude of the LO leakage signal.

RF signal transmission apparatus and control method therefor

The disclosure relates to a communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT). A method of operating an electronic device in a wireless communication system is provided. The method includes inputting training signals into a first loopback route and a second loopback route, determining a loopback gain and a loopback phase, based on a first training signal passing through the first loopback route and a second training signal passing through the second loopback route, determining a frequency domain compensation filter, based on the loopback gain and the loopback phase, determining an FIR filter and a DC offset, based on the frequency domain compensation filter, and compensating for a transmission signal and a reception signal, based on the FIR filter and the DC offset.

Electronic device including transceiver for calibrating I/Q imbalance in millimeter wave communication system and method of operating same

A semiconductor package includes a package substrate, a logic chip on the package substrate, a memory stack structure on the package substrate and including first and second semiconductor chips stacked along a first direction, and a first bump between the package substrate and the memory stack structure. The logic chip and the memory stack are spaced apart along a second direction, crossing the first direction, on the package substrate. The first semiconductor chip includes a through via electrically connected to the second semiconductor chip, a chip signal pad connected to the through via, and a first redistribution layer electrically connected to the chip signal pad and having an edge signal pad in contact with the first bump. A distance between the logic chip and the edge signal pad along the second direction is less than that between the logic chip and the chip signal pad.

Semiconductor package

A substrate includes a substrate body including a plurality of chip mounting regions and a peripheral region surrounding the plurality of chip mounting regions, each of the chip mounting regions including a conductive plane. The substrate further includes a conductive support structure located in the peripheral region, first conductive lines connected between the conductive planes of adjacent chip mounting regions, and second conductive lines connected between the conductive support structure and the conductive planes of chip mounting regions located adjacent the peripheral region.

Substrate strip including conductive plane around periphery of chip mounting regions and method of manufacturing semiconductor package using the same

A semiconductor package comprises a lower package, a metal layer on the lower package, a ground member on the metal layer, coupled thereto, and an upper package on the lower package. The upper package comprises a ground pattern on a first insulation pattern. The first insulation pattern is on a bottom surface of the upper package and has a hole through which the ground pattern is exposed. The ground member extends inside the hole and is coupled to the ground pattern.

Semiconductor packages having reduced stress

Growing community of inventors

Suwon-si, South Korea

Yonghoon Kim