Samsung Electronics Co., Ltd.

Yongha Kim

Youngsoo Jang

Bonggyu Kang

Min Soo Kim

Yongyi Kim

KwangSoo Park

Heesu Kim

Youngmin Seo

Junsik Park

Youngsoo Lee

Yongjoon Choi

A semiconductor package includes a package board, at least one semiconductor chip disposed on the package board, a molding member disposed on the package board and at least partially surrounding the at least one semiconductor chip, and a heat dissipation member disposed on the at least one semiconductor chip and the molding member. The molding member has first region in which a plurality of uneven structures are disposed, and a second region spaced apart from an external region by the plurality of uneven structures. The plurality of uneven structures protrude to a predetermined height away from the semiconductor chip, the molding member, and the heat dissipation member, and may be formed as a part of the head dissipation member, or formed separately.

Semiconductor package including uneven structures and electronic device including the same

An electronic device includes a substrate, a first plate having a first internal surface facing a first surface of the substrate, and at least one first through-hole and at least one second through-hole, first and second semiconductor packages spaced apart from each other between the first surface and the first internal surface, a first thermal interface material layer contacting an upper surface of the first semiconductor package and the first internal surface, and filling at least a portion of the at least one first through-hole, and a second thermal interface material layer contacting an upper surface of the second semiconductor package and the first internal surface, and filling at least a portion of the at least one second through-hole. At least one of side surfaces of the first and second thermal interface material layers is exposed to an empty space between the first internal surface and the first surface.

Electronic device including thermal interface material layer and semiconductor package

Disclosed is an electronic device. An electronic device according to various embodiments includes: a housing; a first glass plate attached to the housing and forming a portion of an external surface of the electronic device, wherein the first glass plate includes a flat portion, a curved portion extending from an edge of the flat portion, a first surface facing outwardly from the electronic device, and a second surface facing inwardly towards the electronic device; and a coating layer formed on the first surface of the first glass plate, wherein the coating layer includes a first layer having a first refractive index and containing at least one first material, and includes a second layer disposed further from the first surface than the first layer, containing at least one second material, and having a second refractive index different from the first refractive index.

Curved glass comprising anti-reflection and anti-scratch coating layer and electronic device

A semiconductor apparatus includes: a system substrate; a semiconductor package mounted on the system substrate and having a first length in a first horizontal direction; a conductive label flexible and arranged on the semiconductor package, the conductive label including: a first adhesive layer contacting the semiconductor package; a thermally-conductive layer attached to the semiconductor package by the first adhesive layer and having a second length in the first horizontal direction greater than the first length; and a second adhesive layer contacting a portion of a surface of the conductive layer, the portion not vertically overlapping the semiconductor package; a thermal interface material (TIM) arranged on the conductive layer to vertically overlap the semiconductor package; and a cover including: a first cover portion vertically overlapping the semiconductor package and contacting the TIM; and a second cover portion to which the thermally-conductive layer is attached by the second adhesive layer.

Semiconductor apparatus for discharging heat

In an embodiment, a liquid planarization material is coated on at least one of a first surface and a second surface of the cover glass. The second surface faces a direction opposite the first surface. The liquid planarization material is pressed toward the cover glass by a pressing plate and cured. Then, the pressing plate is detached from the cured planarization material and the cover glass. Other embodiments are possible.

Growing community of inventors

Gyeonggi-do, South Korea

Yongha Kim