Nova Corporation

Nova Measuring Instruments Ltd.

Yongha Kim

Barak Bringoltz

Eitan Rothstein

Ilya Rubinovich

Ariel Broitman

Oded Cohen

Shay Yogev

Daniel Kandel

Noam Tal

Eylon Rabinovich

Tal Zaharoni

Olga Krasnykov

A semiconductor metrology system including a spectrum acquisition tool for collecting, using a first measurement protocol, baseline scatterometric spectra on first semiconductor wafer targets, and for various sources of spectral variability, variability sets of scatterometric spectra on second semiconductor wafer targets, the variability sets embodying the spectral variability, a reference metrology tool for collecting, using a second measurement protocol, parameter values of the first semiconductor wafer targets, and a training unit for training, using the collected spectra and values, a prediction model using machine learning and minimizing an associated loss function incorporating spectral variability terms, the prediction model for predicting values for production semiconductor wafer targets based on their spectra.

Metrology and process control for semiconductor manufacturing

A system and methods for OCD metrology are provided including receiving training data for training an OCD machine learning (ML) model, including multiple pairs of corresponding sets of scatterometric data and reference parameters. For each of the pairs, one or more corresponding outlier metrics are by calculated and corresponding outlier thresholds are applied whether a given pair is an outlier pair. The OCD MIL model is then trained with the training data less the outlier pairs.

Detecting outliers and anomalies for OCD metrology machine learning

Growing community of inventors

Rehovot, Israel

Yongha Kim