Samsung Electronics Co., Ltd.

Yonggi Cho

Hosik Jun

Jaehyuk Lim

Hyojeong Kang

A light-emitting diode (LED) package includes a substrate including an insulating material; upper pads on an upper surface of the substrate; a side surface molding layer covering the upper surface of the substrate and side surfaces of the upper pads; an LED chip on the upper surface of the substrate and electrically connected to the upper pads; a fluorescent layer on the LED chip; and a reflection molding layer on the substrate and covering the LED chip, the reflection molding layer including white silicon, wherein the reflection molding layer exposes a portion of side surfaces of the fluorescent layer.

Growing community of inventors

Suwon-si, South Korea

Yonggi Cho