Shenzhen Shokz Co., Ltd.

Sz Dji Technology Co., Ltd.

Yonggen Wang

Xinnan Mao

Haofeng Zhang

Jiang Xu

Zeying Zheng

Zhiqing Liu

Zhen Wang

Lei Zhang

Yun Yu

Sunjie Huang

Liwei Wang

Junjiang Fu

Peng Zhang

Fen You

Chong Wang

Guoxiu Pan

Ruixin Han

Gan Lai

Yongjian Li

Yueqiang Wang

Yin Tang

Song Yang

Chaowu Li

Shuailin Xie

Zhongqi Wu

Dan Hu

Qingyu Zeng

Fanyue Wang

The present disclosure provides an earphone including a core module. The core module may include a core housing and a core. The core housing may include a bottom wall and an annular peripheral wall. When a user wears the earphone, the bottom wall may face the head of the user. One end of the annular peripheral wall may be integrally connected with the bottom wall, the other end of the annular peripheral wall that is away from the bottom wall includes an opening, and the core may be disposed in the core housing through the opening. The core may include a magnet configured such that the core module is attachable to a magnetic object through one side of the bottom wall.

Earphones

Visor

An inertial measurement unit (IMU) device includes an IMU sensor, a controller, a temperature sensor electrically connected to the controller, a heat source, and a heat conductive member. The controller is configured to, in response to a temperature of the IMU sensor detected by the temperature sensor falling below a threshold temperature, control the heat source to generate heat. The heat conductive member is configured to transfer heat from the heat source to the IMU sensor, and includes an electrically insulating and thermally conductive material.

Inertial measurement unit and movable device using the same

The present disclosure discloses an earphone. The earphone may include a wearing assembly and a core module. The core module may be disposed on one end of the wearing assembly. The wearing assembly may be configured to fix the core module on a head of a user. The core module may include a core housing, a core, and a cover plate. An opening may be disposed on one end of the core housing, and the cover plate may be covered on the opening of the core housing, so as to form a chamber structure inside the core housing for accommodating the core.

The embodiments of the present disclosure disclose an acoustic apparatus. The acoustic apparatus may include a support assembly. The support assembly may include a first portion and a second portion. When a user is wearing the acoustic apparatus, the first portion may be hung between a first side of an ear and a head of the user, the second portion may contact a second side of the ear. The first portion may cause the second portion to provide a compressive force on the second side of the ear.

Acoustic output apparatuses and assemblies thereof

The present disclosure discloses an earphone. The earphone may include a hook-shaped component, a connecting component, and a holding component. When the earphone is in a wearing state, the hook-shaped component may be configured to hang between a rear side of an ear of a user and a head of the user. The holding component may be configured to contact a front side of the ear. The connecting component may be configured to connect the hook-shaped component and the holding component and extend from the head to an outside of the head to cooperate with the hook-shaped component to provide the holding component with a pressing force on the front side of the ear.

Earphone

The present disclosure discloses an acoustic device and a support assembly thereof. The support assembly may include a shell configured to provide a space for accommodating one or more components of the acoustic device. The support assembly may further include an interaction assembly configured to realize an interaction between a user and the acoustic device, wherein the interaction assembly include a first component and one or more second components, in response to receiving an operation of the user, the first component is configured to trigger at least one of the one or more second components to cause the acoustic device to perform a function corresponding to the at least one of the one or more second components.

Acoustic devices and support assemblies thereof

The present disclosure relates to a bone conduction earphone. The bone conduction earphone may include an ear hook assembly and a core module. The ear hook assembly may include an ear hook housing. The core module may be disposed on one end of the ear hook assembly. The core module may include a core housing and a core. An opening may be disposed on one end of the core housing to form a chamber structure for accommodating the core. An elastic modulus of the core housing may be greater than an elastic modulus of the ear hook housing.

Bone conduction earphones

The present disclosure relates to an apparatus. The apparatus may comprise two ear-hook assemblies configured to be hung outside of two ears of a user respectively, and a rear-hook assembly in a curved shape configured to connect the two ear-hook assemblies and wrap around a rear side of the head of the user. The rear-hook assembly may include an elastic metal filament, wires, and an elastic covering body covering the elastic metal filament and the wires.

Acoustic output apparatus and connection assembly

The present disclosure provides a sound producing device, at least comprising a housing assembly. The housing assembly comprises a housing and a sealing member. The housing is provided with a plug-in hole, and the plug-in hole runs through a side wall of one side of the housing; the sealing member is used for plugging and sealing the plug-in hole; the plug-in hole comprises at least one hole wall segment provided along a plugging direction of the sealing member; the cross-sectional area of a reference cross section of at least part of the at least one hole wall segment perpendicular to the plugging direction of the sealing member increases gradually along the plugging direction; the sealing member is in plugging fit with the at least one hole wall segment.

Sound producing devices

Headphone

Growing community of inventors

Shenzhen, China

Yonggen Wang