Growing community of inventors

Shenzhen, China

Yongfu Sun

Average Co-Inventor Count = 3.81

ph-index = 1

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 2

Yongfu SunJie Yang (3 patents)Yongfu SunJian Shi (3 patents)Yongfu SunLinfang Jin (2 patents)Yongfu SunQuanming Li (2 patents)Yongfu SunLei Peng (2 patents)Yongfu SunGuo Yang (2 patents)Yongfu SunWen Zhang (1 patent)Yongfu SunCheng Wang (1 patent)Yongfu SunJue Wang (1 patent)Yongfu SunRui Li (1 patent)Yongfu SunZhen Sun (1 patent)Yongfu SunHan Zheng (1 patent)Yongfu SunZhi Yuan (1 patent)Yongfu SunZhigang Hao (1 patent)Yongfu SunBaiwan Zhu (1 patent)Yongfu SunChuan Du (1 patent)Yongfu SunDingzhu Lurong (1 patent)Yongfu SunRui Li (0 patent)Yongfu SunZhigang Hao (0 patent)Yongfu SunYongfu Sun (8 patents)Jie YangJie Yang (16 patents)Jian ShiJian Shi (14 patents)Linfang JinLinfang Jin (26 patents)Quanming LiQuanming Li (21 patents)Lei PengLei Peng (19 patents)Guo YangGuo Yang (13 patents)Wen ZhangWen Zhang (83 patents)Cheng WangCheng Wang (30 patents)Jue WangJue Wang (26 patents)Rui LiRui Li (24 patents)Zhen SunZhen Sun (19 patents)Han ZhengHan Zheng (13 patents)Zhi YuanZhi Yuan (12 patents)Zhigang HaoZhigang Hao (3 patents)Baiwan ZhuBaiwan Zhu (2 patents)Chuan DuChuan Du (1 patent)Dingzhu LurongDingzhu Lurong (1 patent)Rui LiRui Li (0 patent)Zhigang HaoZhigang Hao (0 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Huawei Technologies Co., Limited (5 from 27,108 patents)

2. Tencent Technology (shenzhen) Company Limited (3 from 4,813 patents)

3. Tencent Technology Company Limited (0 patent)


8 patents:

1. 12432280 - Method and apparatus for establishing network connection, electronic device, and storage medium

2. 12417149 - Service cluster instance backup and recovery methods and related devices

3. 12405647 - Mobile terminal and middle frame assembly

4. 12336146 - Temperature equalization component and electronic device

5. 11864350 - Heat conduction apparatus and terminal device

6. 11839055 - Heat-conducting assembly and terminal

7. 11284537 - Heat-conducting assembly and terminal

8. 10713135 - Data disaster recovery method, device and system

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idiyas.com
as of
12/5/2025
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