Boe Technology Group Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hefei Xinsheng Optoelectronics Technology Co., Ltd.

Hefei Boe Ruisheng Technology Co., Ltd.

Hefei Xinsheng Optoelectronics Co., Ltd.

Yongfei Li

Ting Zeng

Haifeng Hu

Huan Liu

Xinhong Lu

Jian Yang

Yu Jiang

Heren Gui

Zhanfeng Cao

Qi Qi

Zouming Xu

Jie Wang

Jian Tian

Chunjian Liu

Xintao Wu

Jie Lei

Jianying Zhang

Jianguo Wang

Peng Xu

Yingwei Liu

Song Liu

Zhiwei Liang

Ke Wang

Guoqiang Wang

Dapeng Xue

Qin Zeng

Liuyue Yin

Yan Qu

Liuqing Li

Weiwei Chu

Mengmeng Li

Zhi Jin

Jingshang Zhou

Qi Gao

Wanru Dong

Yuancheng Li

A light-emitting substrate has a light-emitting region and a test region. A plurality of light-emitting device groups and a plurality of driving circuits are disposed in the light-emitting region. The driving circuits include at least one selected driving circuit, and a selected driving circuit includes at least one first-type output terminal and at least one second-type output terminal. The first-type output terminal is electrically connected to the light-emitting device group. A power line is electrically connected to the light-emitting device groups. A first test pad and a second test pad are disposed in the test region. The first test pad is electrically connected to a second-type output terminal of the selected driving circuit, and the second test pad is electrically connected to the power line. The first test device group is electrically connected to the first test pad and the second test pad.

Light-emitting substrate, backlight module and display device

An array substrate and a manufacturing method therefor, a display panel, and a backlight module, are provided. The array substrate may comprise a base substrate, a metal wiring layer, a first planarization layer, an electrode layer, a second planarization layer, and a functional device layer stacked in sequence. The electrode layer comprises a metal sub-layer and a conductive sub-layer stacked on one side of the base substrate in sequence; the material of the metal sub-layer comprises a metal or a metal alloy; the conductive sub-layer has an oxidation resistance and covers the metal sub-layer. The functional device layer is disposed on the side of the second planarization layer distant from the base substrate, and comprises a plurality of functional devices electrically connected to the electrode layer.

Array substrate and manufacturing method therefor, display panel, and backlight module

The present disclosure provides a display substrate, including: a base substrate including a display area and a bonding area; a first metal conductive layer pattern on the base substrate; a first passivation layer on the first metal conductive layer pattern; a second metal conductive layer pattern on the first passivation layer; a second passivation layer on the second metal conductive layer pattern; a first blackening layer pattern is disposed between the first metal conductive layer pattern and the first passivation layer, an orthographic projection of which on the base substrate is located in that of the first metal conductive layer pattern on the base substrate; and/or a second blackening layer pattern is disposed between the second metal conductive layer pattern and the second passivation layer, an orthographic projection of which on the base substrate is located in that of the second metal conductive layer pattern on the base substrate.

Led display substrate and method for manufacturing the same, display panel

A backplane, a backlight source, an illumination device and a displaying device. The backplane comprises a substrate; a first metal trace layer disposed on one surface of the substrate; an insulating layer disposed on a side, away from the substrate, of the first metal trace layer; a second metal trace layer disposed on a side, away from the substrate, of the insulating layer, an overlapping area existing between an orthographic projection of the second metal trace layer on the substrate and an orthographic projection of the first metal trace layer on the substrate; and a barrier layer disposed between the first metal trace layer and the second metal trace layer, an orthographic projection of the barrier layer on the substrate covering the overlapping area, and the barrier layer being used for preventing metals in the first metal trace layer and the second metal trace layer from growing towards each other.

Backplane, backlight source, illumination device and displaying device

The present disclosure provides a driving substrate, including: a flexible substrate including a display region and a bendable region; a first conductive layer on the flexible substrate and including a first wire in the display region, and a connection wire at least partially in the bendable region; a flexible insulating layer including a first insulation pattern in the display region, and a second insulation pattern in the bendable region; a second conductive layer at a side of the flexible insulating layer far away from the flexible substrate; and a planarization layer at a side of the second conductive layer far away from the flexible substrate and having a hollow structure in the bendable region, wherein a thickness of a portion of the second insulating pattern covering the connection wire is d, a thickness of the flexible substrate is d, and d≥2 μm and |d−d|≤3 μm.

Driving substrate, manufacturtion method thereof and display device

A touch substrate includes: a substrate, which includes a touch area and a bonding area on one side of the touch area; and a plurality of pads on the substrate, wherein the plurality of pads are arranged in the bonding area at intervals, wherein the pad includes a first metal layer, a first organic layer and a second metal layer, arranged in this order on the substrate, a first via is formed in the first metal layer, a second via is formed in the first organic layer, an orthographic projection of the first via on the substrate and an orthographic projection of the second via on the substrate do not overlap, a part of the first organic layer is in the first via, and a part of the second metal layer is in contact with the first metal layer through the second via.

Touch substrate and touch device

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Beijing, China

Yongfei Li