Kabushiki Kaisha Toshiba

The University of Tokyo

Yongfang Li

Kazuo Watabe

Takashi Usui

Yasushi Tomizawa

Osamu Nishimura

Hidefumi Takamine

Takahiro Omori

Gen Hashiguchi

Tetsuya Kugimiya

Masakazu Sugiyama

Yuki Ueda

Junko Hirokawa

Keisuke Ueno

Hiroshi Ohno

Hiroyuki Fujita

Takashi Sato

Yutaka Nakai

Yasushi Shinjo

Hideaki Okano

Ryoichi Inanami

Akihiro Koga

Reiko Yoshimura

Koichi Kokubun

Hirohisa Miyamoto

Akiko Mimotogi

Masato Saito

A sensor module according to an embodiment includes a sensor; a sensor holder that holds the sensor and includes a pressing force application portion to apply a pressing force to press the sensor toward a measurement target object side; an adhesion portion that adheres the sensor holder to the measurement target object by an adhesion force; and a change mechanism that changes a relative magnitude relationship between the pressing force and the adhesion force.

Sensor module, sensor module installation device, and mounting method of sensor module

An adhesion/peeling method according to an embodiment includes adhering a first surface side of an electrically peelable adhesive sheet to a predetermined position of a fixation target object, wherein the electrically peelable adhesive sheet is formed of an electro-peeling adhesive having adhesiveness on the first surface side and a second surface side thereof, and the adhesiveness of the electro-peeling adhesive is lowered due to an input of a voltage; adhering a first electrode of an adherend including the first electrode formed of a conductor to the second surface side of the electrically peelable adhesive sheet; containing a liquid at the predetermined position of the fixation target object to temporarily form a second electrode with conductivity on a surface of the fixation target object; and inputting a predetermined voltage between the first electrode and the second electrode to peel of the electrically peelable adhesive sheet from the fixation target object.

Adhesion/peeling method, and adhesion/peeling device

A vibration sensor according to an embodiment includes a laminated body. The laminated body includes a support layer a first end of which is fixed; a piezoelectric layer on the support layer; an insulating layer disposed between the support layer and the piezoelectric layer; a common electrode disposed on a first principal surface of the piezoelectric layer; a first sensing electrode disposed in a first area on a second principal surface of the piezoelectric layer on the side opposite to the first principal surface; and a drive electrode disposed in a second area different from the first area on the second principal surface of the piezoelectric layer. The first area is located near the first end of the support layer.

Vibration sensor and sensor module

A molecular detection apparatus includes a detector. The detector includes: a vibrator having a piezoelectric member that has a first surface and a second surface, a first electrode connected to the first surface, a second electrode connected to the second surface, and a third electrode connected to the second surface and disconnected from the second electrode; a sensitive film overlapping at least one part of the second electrode and at least one part of the third electrode and configured to change a vibration frequency of the vibrator in response to an interaction with target molecules; and a detection electrode to detect the changed vibration frequency.

Molecular detection apparatus

According to one embodiment, an optical deflection element includes a substrate and three or more electrodes. The substrate has an incidence plane which the laser light enters and an emission plane from which the laser light exits. The three or more electrodes are arranged on the substrate at first intervals in a first direction. Electrodes allow a surface acoustic wave having a first wavelength to be generated in the substrate by applying a voltage thereto. Wiring is provided such that a voltage is selectively applied to the electrodes at an interval between at least two electrodes. The electrodes allow a surface acoustic wave having a second wavelength to be generated in the substrate by applying a voltage selectively at second intervals.

Optical deflection element, beam steering apparatus and moving body

According to one embodiment, a sensor module includes a sensor and a diagnosis circuit. The sensor includes piezoelectric transducers and switches. The piezoelectric transducers have different resonance frequencies. The switches are provided to correspond to the piezoelectric transducers, respectively. Each of the switches outputs an output signal corresponding to a voltage generated by an inverse piezoelectric effect of a corresponding piezoelectric transducer of the piezoelectric transducers. The diagnosis circuit diagnoses, based on a difference in pattern of the output signal, whether vibration has newly occurred in the sensor, and switch an output destination of the output signal of the sensor according to a result of the diagnosis.

Sensor module

According to one embodiment, a sensor module includes at least one sensor and at least one switch. The sensor includes a first piezoelectric element. The first piezoelectric element includes a first electrode. The first piezoelectric element is set with a resonance frequency to resonate at a vibration frequency of a detection target. The switch includes a second piezoelectric element. The second piezoelectric element includes a second electrode connected to the first electrode and a third electrode electrically separated from the second electrode.

A edge electrode mold according to an embodiment includes a base having a first main surface and one or more protruding structures disposed on the first main surface. The protruding structures include a protrusion projecting from the first main surface of the base, an edge electrode disposed at the protrusion, and an electrolytic hydrophobic film having electrolytic property and hydrophobicity disposed on the upper end surface of a protruding shape including the protrusion and the edge electrode.

Mold, method of producing mold, production apparratus, and method of manufacturing semiconductor device

According to one embodiment, a pattern transfer mold includes a base body, first and second stacked bodies, first and second electrodes. The base body includes a base unit including a first surface, a first protrusion provided on the first surface and having a first side surface, and a second protrusion provided on the first surface, separated from the first protrusion, and having a second side surface opposing the first side surface. The first stacked body is provided on the first side surface, and includes first conductive layers and a first insulating layer. The second stacked body is provided on the second side surface, separated from the first stacked body, and includes second conductive layers and a second insulating layer. The first electrode is electrically connected to at least one of the first conductive layers. The second electrode is electrically connected to at least one of the second conductive layers.

Pattern transfer mold and pattern formation method

According to one embodiment, a microprobe includes a supporting base, an insulating layer, and an electrode layer arrayed in a first direction in this order. A principal surface of the microprobe is formed in a second direction different from the first direction. A step is formed on at least the electrode layer on the principal surface, and the electrode layer is partitioned into a first area and a second area by the step.

Microprobe, recording apparatus, and method of manufacturing microprobe

According to an embodiment, a microprobe includes a base and a lever. The base includes a first electrode provided on a surface thereof. The lever is supported by the base and includes a second electrode and a third electrode. The second electrode is connected between the first electrode and the third electrode. The third electrode is formed to project from the second electrode in a first direction in a main surface of the lever. A width of the third electrode in a second direction perpendicular to the first direction in the main surface defines a width of an electrical contact area when a scanning operation is performed by use of the third electrode in a third direction perpendicular to the main surface.

Microprobe and microprobe manufacturing method

According to one embodiment, a MEMS memory microprobe includes a probe tip, a lever, and a base. The probe tip is arranged to oppose a recording medium and is brought into contact with the recording medium to perform recording or reproduction of information when a current or voltage is applied between them. In the probe tip, a plurality of electrodes used in the recording or reproduction and a plurality of support portions which form the probe tip together with the electrodes are alternately arranged, and the electrodes and the support portions form a single plane which opposes the recording medium.

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Kawasaki, Japan

Yongfang Li