Hamilton Sundstrand Corporation

Goodrich Corporation

Carrier Corporation

Yongduk Lee

Parag M Kshirsagar

Matthew Robert Pearson

Xin Wu

Bo Liu

Ankit Gupta

Joseph V Mantese

Vladimir Blasko

Suman Dwari

Subramanyaravi Annapragada

Wei Xie

Luis Arnedo

Abbas A Alahyari

Sriram Chandrasekaran

Parikshith B Channegowda

Weilun Chen

Jin Lee

A system having: a power switching circuit providing a drive current to a load, and having: a power source; first and second serially connected switches convert DC power from the power source into AC current to form the drive current, or vice versa; a first high-bandwidth current sensor circuit measures high-side current pulses through the first switch and provides a first analog signal, proportional to the high-side pulses; a second high-bandwidth current sensor circuit measures low-side current pulses through the second switch and provides a second analog signal is proportional to the low-side pulses; a signal processing device coupled to the first and second current sensor circuits performs steps of: converting the first analog signal to a first digital signal and the second analog signal to a second digital signal; and reconstructing the drive current and obtaining its cycle average values from the first and second digital signals.

Current sensor for power electronic converter

A printed circuit board (PCB) assembly includes a first PCB including at least one heat generating component. A second PCB is mounted to the first PCB. The second PCB defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path. A plurality of power pillars extend from the first PCB and across the cooling path.

Printed circuit board (PCB) cooling

Embodiments have two approaches as follows: (1) Embedded PCB-based fabrication and (2) PCB assembly-based fabrication. An embedded printed circuit board (PCB) type approach involves the creation of a space of coolant direct interconnection, using immersion cooling to link on any type of power semiconductor device hot spots to convectively and evaporatively cool directly. This means fabricating PCB embedded channels, to utilize the microgap between die and PCB as the cooling channel. A printed circuit board (PCB) assembly embodiment includes a PCB having at least one heat generating component. A lid is mounted to the PCB, wherein the lid defines a cooling path therein extending in a coolant flow direction from an inlet end of the cooling path to an outlet end of the cooling path.

Immersion cooling electronic devices

Direct pin-fin cooling assemblies are disclosed for a high-power printed circuit boards (PCBs). The disclosure can solve the classical coldplate problem associated with liquid cooling of high-power PCBs namely: (1) Inhomogeneous cooling due to the calorimetric heating up of the coolant, (2) thermal interface material (TIM) related quality issues such as dry-out effects, (3) high cost due to complicated metal coldplate structure, and (4) low thermal conductivity due to multi-layer structure. This includes incorporating pin-fin direct cooling into high-power PCB structures without additional coldplate structure or TIM. In this approach, a TIM and a top plate of coldplate can be removed. Thus, the cooling performance can be improved because the thermal conductivity between a liquid coolant and a power device is increased.

Pin-fin cooling for printed circuit boards (PCBs)

The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.

Mini-channel cold plate with three-dimensional adaptive flow-path using bi-metal fins

A sanitization apparatus includes an excimer lamp and a power converter. The power converter comprises a wide band gap device and a planar inductor. The wide band gap device is selectively switchable between a first mode wherein the inductor is electrically charged and a second mode wherein the inductor is electrically discharged. The wide band gap may be repeatedly switched between the first and second modes to generate a nano second pulse output voltage waveform.

Hybrid power supply systems, methods, and devices for excimer lamps

An excimer lamp includes a plurality of arc tubes and an electrode pair. The electrode pair comprises a plurality of elongated electrode plates extending along a tube axis direction of the plurality of arc tubes. Each electrode plate comprises a polarity opposite that of an adjacent electrode plate (i.e., alternating polarities). The plurality of arc tubes and the plurality of electrode plates are disposed in an alternating side-by-side orientation such that an arc tube of the plurality of arc tubes is disposed between adjacent electrode plates of the plurality of electrode plates.

Excimer lamp electrode geometry

Systems and methods of operating for a smart power router for boosting and protection are provided. Aspects include a power router comprising a plurality of terminals, a first DC power supply coupled to the first terminal, a second DC power supply coupled to the second terminal, a first power converter, an interface bi-directional switch coupled between the first terminal and the second terminal, a first bi-directional switch coupled between the first terminal and the third terminal, the first bi-directional switch comprising a first transistor and a second transistor, a first RL circuit, a controller configured to operate the power router in a plurality of modes comprising a first voltage boosting mode, wherein operating the power router in the first voltage boosting mode comprises operating the interface bi-directional switch in an on state, operating the first transistor in an off state, and operating the second transistor in a switching state.

Smart power router and protection for medium voltage DC distribution

A heat transfer system () is disclosed that includes a first electrocaloric module () comprising a first electrocaloric material, a first high-side voltage electrode, and a first low-side voltage electrode, arranged to impart an electric field to the electrocaloric material. The system also includes a second electrocaloric module () comprising a second electrocaloric material, a second high-side voltage electrode, and a second low-side voltage electrode, arranged to impart an electric field to the electrocaloric material. A bi-directional power transfer circuit () is also included arranged to alternately transfer power from the electrodes of the first electrocaloric module () to the second electrocaloric module (), and from the electrodes of the second electrocaloric module () to the first electrocaloric module ().

Electrocaloric heat transfer system and method of operating the same

A sanitization apparatus includes an excimer lamp, a power converter configured to power the excimer lamp and a controller. The controller is configured to monitor an impedance of the excimer lamp and vary an output voltage waveform of the power converter based upon the impedance.

A sanitization apparatus may include an excimer lamp and a power supply. The power supply includes a power converter including a capacitor, a wide band gap device configured to receive an electric current from the capacitor, and an inductor configured to receive the electric current from the wide band gap device. The power converter is configured to supply a nano second pulse output voltage signal to the excimer lamp.

Pulse switch-based power supply systems, methods, and devices

Systems for a current limiting circuit are provided. Aspects include a first set of batteries coupled to a battery terminal, a power converter coupled to a power converter terminal, wherein the battery terminal is coupled to the power converter terminal, a first current limiting circuit in series with the first set of batteries, wherein the current limiting circuit comprises a first circuit comprising a first transistor in series with a first diode, a second circuit comprising a second transistor in series with a second diode, a first RL circuit, wherein the first RL circuit, the first circuit, and the second circuit are arranged in parallel, a controller configured to operate the first current limiter in a plurality of modes including a battery discharge mode including the controller operating the first transistor in an off state, and operating the second transistor in a switching state.

Multi-functional current limiter for energy storage devices

A heat transfer system is disclosed that includes an electrocaloric element including an electrocaloric material and electrodes arranged to impart an electric field to the electrocaloric material. A first thermal flow path is disposed between the electrocaloric material and a heat sink. A second thermal flow path is disposed between the electrocaloric material and a heat source. An electric power source is in operative electrical communication with the electrodes. The system also includes an arc suppression circuit in series with the electrocaloric element. The arc suppression circuit includes an interruptible electrical connection configured to interrupt the electrical connection in response to detection of an arc between the electrodes, and a series shunt connection in parallel with the interruptible electrical connection, with the series shunt connection including a series shunt load.

Electrocaloric heat transfer system

A system for use in generating a power signal includes a first stage circuit having: a first input line coupled to a first stage first parallel line having a first stage first switch positioned thereon, a second input line coupled to a first stage second parallel line having a first stage second switch positioned thereon, and a first stage third parallel line oriented in parallel with the first stage first parallel line and the first stage second parallel line between a positive rail and a negative rail, the first stage third parallel line having a first capacitor positioned thereon. The system further includes a second stage circuit having a resonant inverter coupled between the positive rail and the negative rail and configured to output the power signal.

Transformer-less AC-DC input compatible boost resonant inverter

A system for controlling a power signal for zero voltage switching (ZVS) includes a voltage zero crossing detection module to detect a zero voltage condition in response to an inverter voltage from a resonant inverter crossing zero volts, and a current zero crossing detection module to detect a zero current condition in response to an inverter current from the resonant inverter crossing zero amps. The system further includes a phase detect module to detect actual phase data corresponding to an actual phase angle between the inverter voltage and the inverter current based on the zero voltage and zero current condition. The system further includes a comparator to determine a phase difference between a desired phase between the inverter voltage and the inverter current and the actual phase angle. The system further includes a controller to adjust a property of a resonant inverter to reduce the phase difference.

Growing community of inventors

Vernon, CT, United States of America

Yongduk Lee