International Business Machines Corporation

Globalfoundries Inc.

Yongchun Xin

Jang Sim

Jonathan R Fry

Daniel Piper

Tso-Hui Ting

Yunsheng Song

Ping-Chuan Wang

Oleg Gluschenkov

Xu Ouyang

Robert Daniel Edwards

Louis V Medina

Zhigang Song

Keith Kwong Hon Wong

Junjing Bao

Zhijian Yang

Oliver Desmond Patterson

A micro electrical mechanical system (MEMS) valve is provided. The MEMS valve includes first and second bodies, a medium and a thermal element. The first body defines a first channel and a second channel intersecting the first channel. The second body defines a third channel and is movable within the first channel between first and second positions. When the second body is at the first positions, the second and third channels align and permit flow through the second and third channels. When the second body is at the second positions, the second and third channels misalign and inhibit flow through the second channel. The medium is charged into the first channel at opposite sides of the second body. The thermal element is proximate to the first channel and is operable to cause the medium to drive movements of the second body to the first or the second positions.

Micro electrical mechanical system (MEMS) valve

Microfluidic chips incorporating liquid level sensors for precise sensing of liquid levels in microfluidic system structures, e.g., channels, cavities or reservoirs without moving parts. The microfluidic system uses liquid level photosensors and use optical properties to measure liquid volumes. A light coupling emitter or waveguide transmits the light toward the fluid channel at a critical angle. Multiple light coupling emitters and photosensor array can detect light for a variety of scenarios (based on fluid refraction index) and exploit the phenomenon of critical angles to measure exact angles of reflection/refraction. The waveguide coupler(s) and photosensors are manufactured at the microscale, and use both reflected light and refracted light as monitor signals. A feedback control system (e.g., compensating for rate and tolerance drift) is devised using signals generated by the sensors upon detecting reflected or refracted sensed light for increased accuracy of detecting precise amounts of fluid volumes being dispensed.

MEMS optical liquid level sensor

A MEMS multiplexing system including: first and second fluid inputs; and a mixing network. The mixing network including: a first channel to receive the first fluid input; a second channel to receive the second fluid input; a multiplexing valve communicating with the first channel and the second channel, the multiplexing valve to cause the transport of the first fluid into the second channel so as to form a first interleaved fluid downstream from the multiplexing valve in the second channel and to cause the transport of the second fluid into the first channel so as to form a second interleaved fluid downstream from the multiplexing valve in the first channel; and the first channel and the second channel intersecting downstream from the valve so as to force mixing of the first interleaved fluid and the second interleaved fluid.

Micro electrical mechanical system (MEMS) multiplexing mixing

A self-cleaning sensor to determine a level of a liquid includes a tube with an interior coating and a plurality of horizontally aligned, electrically isolated, electrical contacts. The self-cleaning sensor includes the plurality of horizontally aligned, electrically isolated, electrical contacts that each terminate in an outer surface of an interior wall of the tube and are electrically connected to one or more electrical devices in a cap residing on the tube. Additionally, the self-cleaning sensor includes a float that is composed of a low density, low dielectric constant material buoyant in one or more liquids to be measured where each horizontal dimension of the float corresponds to each horizontal dimension of the tube.

Self-cleaning liquid level sensor

A micro electrical mechanical system (MEMS) optical sensor including a fluid channel having an input portion, an output portion and a curved portion positioned between the input portion and the output portion; a light source impinging on a first boundary of the curved portion and exiting from a second boundary of the curved channel; a photodetector to record a light path of refraction of the light source exiting from the second boundary of the curved portion; a processor to compute the refractive index of a fluid in the curved portion using the light path of refraction of the light source and compare the computed refractive index to a known refractive index for the fluid to determine a difference between the computed refractive index and the known refractive index.

MEMS optical sensor

A test structure for an integrated circuit device includes a series inductor, capacitor, resistor (LCR) circuit having one or more inductor elements, with each inductor element having at least one unit comprising a first segment formed in a first metal layer, a second segment connecting the first metal layer to a semiconductor substrate beneath the first metal layer, and a third segment formed in the semiconductor substrate; and a capacitor element connected in series with each inductor element, the capacitor element defined by a transistor gate structure including a gate electrode as a first electrode, a gate dielectric layer, and the semiconductor substrate as a second electrode.

LCR test circuit structure for detecting metal gate defect conditions

A wafer probing system includes a probe card assembly having a plurality of individual probe structures configured make contact with a semiconductor wafer mounted on a motor driven wafer chuck, with each probe structure configured with a pressure sensing unit integrated therewith; and a controller configured to drive the probe card assembly with one or more piezoelectric driver units response to feedback from the pressure sensing units of the individual probe structures.

Semiconductor wafer probing system including pressure sensing and control unit

A method for depositing a conductor in the via opening electronic structure removes the via bottom liner so that the conductor deposited in the via opening directly contacts the underlying conductive layer. The method includes depositing amorphous silicon over the dielectric layer and the liner layer on the via opening sidewalls and bottom. The amorphous silicon extends substantially over the entire via opening while leaving below a void within the via opening. The amorphous silicon over the via opening and on the via opening bottom and the liner layer on the via opening bottom are anisotropically etched to leave a layer of amorphous silicon over the dielectric layer and the via opening side walls. The amorphous silicon is then removed to form a via opening having a substantially open-bottom liner. The conductor is then deposited in the via opening and contacts the underlying conductive layer.

Method for manufacturing in a semiconductor device a low resistance via without a bottom liner

A method for designing, a structure, method of inspecting and a computer system for designing voltage contrast integrated circuit characterization. The design method includes selecting a design level of a mask design shapes file; selecting a region of the design level having an open region having no design shapes and an adjacent circuit region having circuit design shapes; selecting a sub-region of the circuit region adjacent to the open region; copying design shapes of the sub-region to generate a characterization cell identical to the sub-region; modifying the characterization cell to generate a passive voltage contrast characterization cell; and placing the passive voltage contrast characterization cell into the open region adjacent to the sub-region to generate a modified design level.

Voltage contrast characterization structures and methods for within chip process variation characterization

Pressure sensing and control for semiconductor wafer probing

Randomized coded arrays and method of forming a randomized coded array. The methods include: forming a dielectric layer on a semiconductor substrate; forming an array of openings extending through the dielectric layer; introducing particles into a random set of less than all of the openings; and forming a conductive material in each opening of the array of openings, thereby creating the randomized coded array, wherein a first resistance of a pathway through the conductive material in openings containing the particles is different from a second resistance of a path through openings not containing the particles. Also, a physically unclonable function embodied in a circuit.

Random coded integrated circuit structures and methods of making random coded integrated circuit structures

An on-chip technique for noncontact electrical testing of a test structure on a chip is provided. On-chip photodiodes receives pump light from a pump light source, where the on-chip photodiodes are electrically connected to the test structure and are configured to generate power for the test structure. An on-chip coupling unit receives probe light from a probe light source, where the on-chip coupling unit is optically connected to on-chip waveguides through which the probe light is transferred. On-chip switches open in response to receiving voltage output from the test structure, and the on-chip switches remain closed when the voltage output is not received from the test structure. The on-chip switches pass the probe light when opened by the voltage output from the test structure. The on-chip switches block the probe light by remaining closed, when the voltage output is not received from the test structure.

Growing community of inventors

Poughkeepsie, NY, United States of America

Yongchun Xin