Eastman-kodak Company

Nitto-denko Corporation

Eastman Kodak

Yongcai Wang

Charles Chester Anderson

John Andrew Lebens

Dennis E Smith

Alfred B Fant

James Lee Bello

Hwei-Ling Yau

David P Trauernicht

Mario D DeLaura

Kurt Michael Schroeder

Ronald S Cok

Janglin Chen

Gary W Visconte

Paul Matthew Hoderlein

Catherine A Falkner

Brian A Schell

Melvin M Kestner

Dwight W Schwark

Lori J Shaw-Klein

Thomas B Brust

Paul D Yacobucci

Kristine B Lawrence

Sridhar Sadasivan

John Leonard Muehlbauer

Tiecheng A Qiao

Kevin M O'Connor

Timothy J Hubert

Mitchell Lawrence Wright

Debasis Majumdar

Yeh-Hung Lai

Loretta E Allen

Stephen M Reinke

Lixin Chu

Timothy C Schunk

Mridula Nair

Teh-Ming Kung

Douglas Robert Robello

Richard Allen Castle

Terry A Heath

Robert E McCovick

Thomas P Nicholas

Alain E Gros

Mark Edward Irving

James D Huffman

Mark Lelental

Roger Guy Markham

Elizabeth A Gallo

John L Pawlak

Joseph Salvatore Sedita

Michael W Orem

Robert J Kress

Edward Schofield

John M Baier

Tien-Teh Chen

Jeffrey A Trest

Michael J Carmody

Weibin Zhang

Brian J Kelley

Patrick M Jeffries

Justin Z Gao

Margaret D Steele

Douglas H Axtell

Cheryl Lenhard

Joseph Anthony Manico

John Randall Fredlund

Steven Evans

Mitchell Stewart Burberry

Thomas Henry Whitesides

Allan Francis Sowinski

Peter J Twist

Lloyd A Lobo

Tamara K Jones

Jehuda Greener

Robert O James

Alexandra DiLauro Bermel

Mark R Mis

Xiaoru Wang

Allan Wexler

YuanQiao Rao

James West Blease

Daniel L Kapp

Gary L House

David E Decker

Fugui He

Wen-Li A Chen

Richard C Reem

Kenneth L Tingler

Vito A DePalma

James R Bennett

David J Giacherio

Daniel Talbot Linehan

Brian P Cleary

Peter David Rollinson

Gregory William Keyes

Christine M Vargas

Dale E DeCann

Herong Lei

Ibrahim M Shalhoub

Robert H Fehnel

Donald J Majka

A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

Making thin-film multi-layer micro-wire structure

Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150&#xb0; C. The photocurable layer has a viscosity &#x3c;5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 &#x3bc;m and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.

Articles with conductive micro-wire pattern

A method of making an imprinted electronic sensor structure on a substrate for sensing an environmental factor includes coating, imprinting, and curing a curable layer on the substrate to form a plurality of spatially separated micro-channels extending from the layer surface into the cured layer. First and second layers are located in each micro-channel to form a multi-layer micro-wire. Either the first layer is a cured electrical conductor forming a conductive layer located only within the micro-channel and the second layer is a reactive layer or the first layer is a reactive layer and the second layer is a cured electrical conductor forming a conductive layer located only within the micro-channel. The reactive layer is exposed to the environmental factor and at least a portion of the reactive layer responds to the environmental factor.

Making imprinted thin-film electronic sensor structure

A method of making a conductive article includes providing a substrate having a surface with one or more micro-channels having a width of less than 12 &#x3bc;m. A composition is provided over the substrate and in the one or more micro-channels. The composition includes water and silver nanoparticles dispersed in the water and he weight percentage of silver in the composition is greater than 70% and the viscosity of the composition is in a range from 10 to 10,000 centipoise. The composition is removed from the surface of the substrate. The composition provided in the micro-channels is dried and converted to form one or more electrically conductive micro-wires.

Method of making electrically conductive micro-wires

A thin-film multi-layer micro-wire structure includes a substrate and a layer located on the substrate or forming a part of the substrate. One or more micro-channels are located in the layer. Each micro-channel has a width less than or equal to 20 microns. A cured electrically conductive micro-wire is located only within each micro-channel. The micro-wire has a thickness less than or equal to 20 microns, including silver nano-particles, and having a percent ratio of silver that is greater than or equal to 40% by weight. An electrolessly plated layer is located at least partially within each micro-channel between the micro-wire and the layer surface and in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.

Thin-film multi-layer micro-wire structure

A method of making a micro-channel structure and applying a curable ink to the micro-channel structure includes providing a substrate and depositing a single layer of a curable polymer on the substrate, the single curable layer having a layer thickness. One or more micro-channels adapted to receive curable ink are embossed into the single curable layer, the micro-channels having a micro-channel thickness that is in a range of two microns to ten microns less than the layer thickness. The single curable layer is cured to form a single cured layer so that deformations of the micro-channels or the surface of the single cured layer are reduced. Curable ink is coated over the surface and micro-channels of the single cured layer. The curable ink is removed from the surface of the single cured layer and the curable ink is cured.

Method of making micro-channel structure for micro-wires

A method of making a multi-layer micro-wire structure includes providing a substrate having a surface and forming a plurality of micro-channels in the surface. A first material composition is located in a first layer only in each micro-channel and not on the surface. A second material composition different from the first material composition is located in a second layer different from the first layer only in each micro-channel and not on the surface. The first material composition in the first layer and the second material composition in the second layer form an electrically conductive multi-layer micro-wire in each micro-channel.

Making multi-layer micro-wire structure

A method of making an imprinted multi-layer structure includes providing a support and locating a first curable layer including a first material on or over the support. A second curable layer including a second material different from the first material is located on or over the first curable layer. The first curable layer and the second curable layer are imprinted in a single step with an imprinting stamp having a structure with a depth greater than the thickness of the second curable layer. The first curable layer and the second curable layer are cured in a single step to form a first cured layer and a second cured layer. The imprinting stamp is removed to form an imprinted multi-layer structure with a depth greater than the thickness of the second cured layer.

Making imprinted multi-layer structure

Micro-wires are arranged to form an electrical conductor connected to an electrode structure. The electrical conductor includes a plurality of spaced-apart first micro-wires extending in a first direction, wherein one of the first micro-wires is a connection micro-wire. A plurality of spaced-apart second micro-wires extends in a second direction different from the first direction. At least two adjacent second micro-wires are spaced apart by a distance greater than the spacing between at least two adjacent first micro-wires. Each second micro-wire is electrically connected to at least two first micro-wires. The electrode structure includes a plurality of electrically connected third micro-wires electrically connected to the connection micro-wire at spaced-apart connection locations and at least some of the adjacent connection locations are separated by a distance greater than any of the distances separating the second micro-wires.

Micro-wire pattern for electrode connection

Preparation of articles with conductive micro-wire pattern

An electrical conductor includes a substrate having micro-channels formed in the substrate. A plurality of spaced-apart first micro-wires is located on or in the micro-channels, the first micro-wires extending across the substrate in a first direction. A plurality of spaced-apart second micro-wires is located on or in the micro-channels, the second micro-wires extending across the substrate in a second direction different from the first direction. Each second micro-wire is electrically connected to at least two first micro-wires and at least one of the second micro-wires has a width less than the width of at least one of the first micro-wires.

Micro-wire electrode buss

A pattern of conductive micro-wires as in a conductive pattern can be prepared using photo-lithography, or imprint technology. A photocurable composition is cured to form a pattern of photocured micro-channels. A conductive composition comprising metal nano-particles is added to the photocured micro-channels and excess conductive composition outside the photocured micro-channels is removed. The conductive composition in the photocured micro-channels is then dried at a temperature of less than 60&#xb0; C. The dried conductive composition in the photocured micro-channels is treated with hydrogen chloride vapor to form conductive micro-wires in the photocured micro-channels at a temperature of less than 60&#xb0; C. The outer surface of the conductive micro-wires is then polished in the presence of water, to form a micro-wire pattern.

Method of forming conductive films with micro-wires

A metal nanoparticle composition includes water and a water-soluble polymer having both carboxylic acid and sulfonic acid groups. Silver nanoparticles are dispersed in the water such that the weight percentage of silver in the composition is greater than 10%.

Silver metal nanoparticle composition

A conductive micro-wire structure includes a substrate. A plurality of spaced-apart electrically connected micro-wires is formed on or in the substrate forming the conductive micro-wire structure. The conductive micro-wire structure has a transparency of less than 75% and greater than 0%.

Conductive micro-wire structure

An inkjet ink composition comprising water, and at least one water-dispersible polyurethane/urea polymer having at least a first soft segment formed from a polyol prepolymer and at least a second soft segment formed from a polyamine prepolymer, wherein the polyol prepolymer forms urethane bonds in the polyurethane/urea and the polyamine prepolymer forms urea bonds in the polyurethane/urea, and further wherein at least about 4% by weight of the combined soft segments is formed by polyamine prepolymers that form urea bonds in the polyurethane/urea polymer.

Inks for high speed durable inkjet printing

Growing community of inventors

Rochester, NY, United States of America

Yongcai Wang