Qualitau, Inc.

Yongbum (Peter) Cuevas

Maurice C Evans

Adalberto M Ramirez

Robert M Sikora

Robert J Sylvia

A socket for use in testing packaged integrated circuits having leads depending therefrom includes a first member for receiving the integrated circuit package and having a plurality of holes for receiving leads extending from the package. A second member has a plurality of wire contacts for engaging the leads, the first and second members being arranged to permit relative lateral translation thereof. A cam is provided for sliding the first member relative to the second member and moving leads extending through the holes in the first member into engagement with the contacts of the second member. A socket for dual in-line integrated circuit package (DIP) has two rows of holes in the first member, and two slots are provided in the second member each aligned with a row of holes. The wire contacts extend across each slot. For high temperature operation (greater than 250&deg; C.) the first and second members comprise anodized aluminum or a ceramic, and the wires comprise Monel or other high temperature material.

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Los Gatos, CA, United States of America

Yongbum (Peter) Cuevas