Richtek Technology Corporation

Yong-Zhong Hu

Chih-Wen Hsiung

Chien-Yu Chen

Ta-Yung Yang

Chien-Wei Chiu

Kuo-Chin Chiu

Wu-Te Weng

Kun-Huang Yu

Ting-Wei Liao

Chun-Lung Chang

Chin-Chin Tsai

A polysilicon-insulator-polysilicon (PIP) structure includes: a first polysilicon region formed on a substrate; a first insulation region formed outside one side of the first polysilicon region and adjoined to the first polysilicon region in a horizontal direction; and a second polysilicon region formed outside one side of the first insulation region. The first polysilicon region, the first insulation region and the second polysilicon region are adjoined in sequence in the horizontal direction. The second polysilicon region is formed outside the first insulation region by a first self-aligned process step, and the first insulation region is formed outside the first polysilicon region by a second self-aligned process step.

Pip structure and manufacturing methods of high voltage device and capacitor device having PIP structure

A high voltage device includes: a semiconductor layer, a well, a bulk region, a gate, a source, and a drain. The bulk region is formed in the semiconductor layer and contacts the well region along a channel direction. A portion of the bulk region is vertically below and in contact with the gate, to provide an inversion region of the high voltage device when the high voltage device is in conductive operation. A portion of the well lies between the bulk region and the drain, to separate the bulk region from the drain. A first concentration peak region of an impurities doping profile of the bulk region is vertically below and in contact with the source. A concentration of a second conductivity type impurities of the first concentration peak region is higher than that of other regions in the bulk region.

High voltage device and manufacturing method thereof

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Hsinchu, Taiwan

Yong-Zhong Hu