Dow Global Technolgoies LLC

Evergreen Packaging, Inc.

North Carolina State University

Pathogen Removal and Diagnostic Technologies Inc.

Yong Zheng

Brian W Walther

Santosh S Bawiskar

Andong Liu

Jeffrey M Kalman

Yi Zhang

Andrew Brent Mendenhall

Hongyu Chen

Ruben Guillermo Carbonell

Cristina Serrat

Jason Scott Andrews

Todd Christopher Midkiff

Roderick William Kalberer

Michael B Biscoglio

Yunlong Guo

Suzanne M Guerra

Patrick Vasconcelos Gurgel

Sydney E Hansen

Celso S Martinez

Bruce Bitowft

Haiyan Liu

Samana Roy Chowdhury

Todd Midkiff

Jason S Andrews

Sumana Roy Chowdhury

The disclosure relates to a tie resin formulation for use as a tie layer in a multilayer structure. The resin includes a first polyolefin grafted with an ethylenically unsaturated carboxylic acid, an ethylenically unsaturated acid derivative or a combination thereof, and having a density of 0.857 to 0.885 g/cm, and 0.001 to 0.20 weight percent (wt. %) of a catalyst comprising at least one Lewis acid, where the resin includes the catalyst and up to 99.999 wt. % of the first polyolefin, where the wt. % is based on a total weight of the resin.

Resins for use as tie layer in multilayer structure and multilayer structures comprising the same

The disclosure relates to a tie resin formulation with excellent adhesion to polyethylene terephthalate (PET). The resin includes (A) an ethylene acrylate copolymer formed from ethylene and alkyl acrylate, where the ethylene acrylate copolymer has an acrylate content of 10 to 30 weight percent and an ethylene content of 90 to 70 weight percent based on the total weight of the ethylene acrylate copolymer and the acrylate content and (B) a transesterification catalyst; where the resin includes: 30 to 99.999 weight percent of the ethylene acrylate copolymer based on the total weight of the resin; 0.001 to 10 weight percent of the transesterification catalyst based on the total weight of the resin; and (C) 0 to 69.999 of a non-polar polyolefin based on the total weight of the resin.

Resin for use as a tie layer in multilayer structure having polyethylene terephthalate

The present invention provides resins that can be used as a tie layer in a multilayer structure and to multilayer structures including one or more tie layers formed from such resins. In one aspect, a resin for use as a tie layer in a multilayer structure that includes a high density polyethylene having a density greater than 0.960 g/cm3, wherein the high density polyethylene includes 1 to 99 weight percent of the resin, a maleic anhydride grafted high density polyethylene, wherein the maleic anhydride grafted high density polyethylene includes 1 to 99 weight percent of the resin, and a catalyst including at least one Lewis acid.

A tie resin is provided that is an extrudable blend of anhydride modified polypropylene and anhydride modified polyethylene suitable for use as a tie resin in coextrusions of polypropylene, polyethylene, nylon and EVOH materials.

Polyethylene and polypropylene based tie resin for co-extrusion

A paperboard substrate that can be used to provide a food packaging particle is provided having a water vapor barrier layer comprising HDPE in combination with a nucleating agent which is extruded on to a paperboard substrate. The resulting substrate has sufficiently good water vapor barrier when properties that dry foods such as cereals do not require a bag or inner liner as a separate moisture barrier.

Container with high moisture barrier properties and a reclosable pour spout

The present invention describes a novel process for the conformal coating of polymer fibers of nonwoven substrates. This process is based on modification of polymer fiber surfaces by controlling the degree of etching and oxidation to improve adhesion of initiators to the surface and to facilitate subsequent conformal polymer grafting. The modified fiber surfaces render new functionalities to the surface, such as increased hydrophilicity, attached ligands or changed surface energy. The invention includes the modified polymer fibers produced by the process described herein.

Conformal coating of polymer fibers on nonwoven substrates

Growing community of inventors

Cary, NC, United States of America

Yong Zheng