Xiamen Changelight Co., Ltd.

Biosteed Gene Expression Tech. Co., Ltd.

Yong Zhang

Wei Jiang

Zhiwei Lin

Kaixuan Chen

Xiangjing Zhuo

Tianzu Fang

Junxian Li

Yingce Liu

Zhendong Wei

Xiangwu Wang

Li Sun

Yang Wang

Weidong Zhou

Jichu Tong

Qingjiang Xiao

Tiebing Wang

Min Liu

Fenghong Yin

Lu Zhuang

Xinmao Huang

Liang Chen

Qimeng Lv

Xiaoping Li

Yinqiao Zhang

Shihong Luo

Tianle Xu

A semiconductor wafer includes a substrate (), a buffer layer () deposited on the substrate (), and an epitaxial layer () above the buffer layer (). The buffer layer () includes a plurality of semiconductor material layers () and a plurality of oxygen-doped material layers (). The semiconductor material layers () and the oxygen-doped material layers () are deposited in an alternating arrangement on top of each other. Oxygen concentrations of the oxygen-doped material layers () gradually decrease along a direction from the substrate () to the epitaxial layer ().

Light-emitting diodes with buffer layers

According to at least some embodiments of the present disclosure, a light-emitting diode (LED) chip includes a semiconductor material portion, a transparent conductive layer disposed above the semiconductor material portion, a current blocking layer disposed above the transparent conductive layer, one or more electrodes disposed above the current blocking layer, and a plurality of electron outflow channels that electrically interconnect at least one electrode and the semiconductor material portion across the transparent conductive layer and the current blocking layer.

Light-emitting diode chips with enhanced brightness

An HV-LED module having 3D light-emitting structure and a method for manufacturing the HV-LED module are disclosed. The HV-LED module has at least two stacked parts of substage LEDs that each have an independent light-emitting structure and are bonded in a staggered pattern, and the substage LEDs are connected in series to form the 3D light-emitting structure, thereby significantly increasing light-emitting power per unit area, downsizing a high-voltage chip module using it by nearly two times, and effectively reducing packaging costs for the HV-LED module.

HV-LED module having 3D light-emitting structure and manufacturing method thereof

Growing community of inventors

Xiamen, China

Yong Zhang