Tencent Technology (shenzhen) Company Limited

Huawei Technologies Co., Limited

Hon Hai Precision Industry Co., Ltd.

Zte Corporation

Sz Dji Technology Co., Ltd.

Foxconn Technology Co., Ltd.

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

Fu Zhun Precision Industry (shen Zhen) Co., Ltd.

Shenzhen Institutes of Advanced Technology

Oneplus Technology (shenzhen) Co., Ltd.

Shenzhen China Star Optoelectronics Technology Co., Ltd.

Fih (hong Kong) Limited

Shenzhen Futaihong Precision Industry Co., Ltd.

Luxshare Precision Industry Company Limited

Fulian Yuzhan Precision Technology Co., Ltd

Yong Yang

Hao Wu

Meng Chen

Yong Li

Bin Wang

Fangyun Liu

Chaojun Deng

Xin Liu

Liang Wu

Dong Liang

Yajun Yu

Hanping Chen

Jin Hu

Xiaodong Huang

Wei Wu

Jie Zhang

Hao Li

Yong Zhang

Bo Wang

Hongying Jiang

Zhuobin Zheng

Hai-Lin Chen

Xiaoyun Wei

Zhihao Wang

Yuanbin Chen

Feifei Liu

Mingyang Sun

Xuan Zong

Yanqiang Zheng

Fei You

Maozheng Luo

Yiwen Jia

Lilei Wang

Hongchao Zhao

Zhan Li Hu

Jen-Hong Hsu

Hai Rong Zheng

Yu-Guo Zhang

Shunming Huang

Liguang Sun

Ke Wang

Bo Hu

Yunfei Zhang

Cong Wang

Hui Li

Wei He

Jing Guo

Xu Zhang

Jia Li

Jinhui Wang

Jin Wang

Zhendong Wang

Fang Xiao Wang

Xindong Teng

Wen-Pin Wang

Bo Chen

Hui Huang

Ming Zhao

Ming He

Minghui Wang

Qi Yang

Yanqing Jing

Chia-En Lee

Sixi Lu

Fei Zheng

Zhidong Zhang

Yinjun Han

Jianfei Li

Yan Qi

Huaheng Fan

Weixin Wang

Xiaodong Gong

Yu Guo

I-Ting Huang

Wuyu Han

Shuang Yang

Hongbo Liu

Chun Yang

Wei Tian

Jianhua Huang

Ling Long

Yao-Shih Chung

Zexiao Wu

Yin Lu

Te Li

Rong Xu

Xinhua Huang

Yuhui Song

Rongjin Zheng

Hai-Peng Yan

Feng Wen

Wentao Tang

Ting Gao

Yu-Jen Chang

Zhuoming Chen

Xiaochen Liu

Miaomiao Ma

A chip package structure includes a glass substrate, a routing layer, and a plurality of dies. A first surface of the glass substrate has solder joints and a second surface of the glass substrate has substrate solder balls. The routing layer is located in the glass substrate, and the solder joints are electrically connected to the substrate solder balls by using the routing layer. Each die has chip solder balls, is located on the first surface of the glass substrate, and the solder joints are bonded to the chip solder balls. The embodiments can improve connection reliability between the die and the glass substrate and can reduce a signal transmission loss.

Chip package structure, preparation method, and electronic device

Charging connector for electric vehicles

A video transmission method includes that a terminal sends first field of view information to a server through a first link based on a first period. The server receives the first field of view information from the terminal through the first link based on the first period. After determining, based on a second period, that the first field of view information is latest field of view information, the server obtains data of a first frame of image corresponding to the first field of view information, and sends the data of the first frame of image to the terminal through a second link. The terminal receives the data of the first frame of image from the server through the second link based on the second period.

Video transmission method, apparatus, and system

A communication method and apparatus are disclosed. The method includes: after determining that a first base station is affected by atmospheric duct interference from a second base station, the first base station sends first information to the second base station through a core network, to notify the first base station that the first base station causes atmospheric duct interference to the second base station. After determining that the first base station is affected by the atmospheric duct interference from the second base station, the first base station notifies the second base station in a wired link manner, and may send the first information to the second base station through the core network.

Atmospheric duct interference elimamating scheme

Earphone

A method includes: obtaining a number of vehicles passing a driving road segment within a duration; determining whether the driving road segment is a sparse road segment by determining whether the number of vehicles is less than or equal to a vehicle threshold; obtaining first real-time driving data transmitted by a first vehicle the target road segment, and obtaining first driving characteristic-information of the target road segment based on the first real-time driving data; obtaining second real-time driving data transmitted by a second vehicle passing a topology road segment, and obtaining second driving characteristic-information of the target road segment based on the second real-time driving data, the topology road segment being a road segment within a target range of the target road segment; and generating road-condition information of the target road based on at least the second driving characteristic-information.

Method for obtaining road condition information, apparatus thereof, and storage medium

A load device control method includes an adapter apparatus receiving a control command sent by an unmanned aerial vehicle (UAV) for controlling a load device connected to the UAV via the adapter apparatus, converting a first communication protocol between the UAV and the adapter apparatus into a second communication protocol between the adapter apparatus and the load device, and sending the control command to the load device using the second communication protocol.

Load device control method, adapter apparatus, unmanned aerial vehicle, and control terminal

A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

Clock oscillator and clock oscillator production method

A method includes: determining M channel state information CSI beams, where interference noise power of a DMRS pilot signal carried on each of the M CSI beams is greater than a first preset value, interference noise power of an SRS pilot signal carried on each of the M CSI beams is greater than a second preset value, the M CSI beams are same-layer beams on a horizontal plane, the same-layer beams include N CSI beams, and M and N are positive integers; and if a ratio of M to N is greater than a third preset value, skipping scheduling and sending the N CSI beams included in the same-layer beams.

Interference suppression method and base station

A control method includes obtaining lock information including a flight platform identification and sending a lock message to a control device according to the lock information. The control device includes a flight platform corresponding to the flight platform identification or an adapter ring carried by the flight platform. The lock message indicates to lock a load carried by and communicatively connected to the flight platform.

Control method, device, and system for locking load carried by flight platform

Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

Chip and manufacturing method thereof, and electronic device

A flat-panel display device described herein includes a display screen; a display backplate; a chassis slidably arranged on the display backplate; a fixing support, a motion module arranged on the chassis, wherein the motion module includes a first telescopic assembly and a second telescopic assembly arranged on the fixing support; a first speaker arranged on the chassis; and a second speaker connected to the second telescopic assembly. The first telescopic assembly is matched with the display backplate and configured to drive the chassis, the first speaker, the second speaker and the second telescopic assembly to move back and forth in a first direction relative to the display backplate. The second telescopic assembly is configured to drive the second speaker to move back and forth in a second direction relative to the display backplate and the first speaker.

Flat-panel display device, sound generating device and electronic device

Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.

Vertical interconnection structure and manufacturing method thereof, packaged chip, and chip packaging method

A speaker structure comprises a main speaker, an auxiliary speaker, a first driving mechanism, and a second driving mechanism. The auxiliary speaker is connected to the main speaker and displaceable relative to the main speaker. The first drive mechanism is configured to drive the main speaker to reciprocate in a first direction, and the second driving mechanism is configured to drive the auxiliary speaker to reciprocate in a second direction relative to the main speaker. The first driving mechanism is arranged in the main speaker, and the second driving mechanism is arranged in the main speaker. An output end of the second driving mechanism extends out of the main speaker and connected to the auxiliary speaker.

Speaker structure and display device

A rotating device and a rotating radar device. The rotating device comprises a fixed platform and a rotating platform; the top of the fixed platform and the bottom of the rotating platform are rotatably connected by a rotating shaft, a first bearing, and a second bearing; the rotating shaft is connected to the inner ring; the fixed platform includes a carbon brush and a first magnetic member; the rotating platform includes a second magnetic member and a rotor conductive ring; an outer ring of the first bearing is connected to the fixed platform; an inner ring of the second bearing is connected to the fixed platform, and an outer ring of the second bearing is connected to the rotating platform.

Rotating device and rotating radar device

Growing community of inventors

Shenzhen, China

Yong Yang