Fih (Hong Kong) Limited

Shenzhen Futaihong Precision Industry Co., Ltd.

Tyco Electronics (Shanghai) Co., Ltd.

Measurement Specialties (Chengdu) Ltd.

Te Connectivity Corporation

Shenzhen Ami Technology Co., Ltd

Te Connectivity Services Gmbh

Scienbizip Consulting(shenzhen)co., Ltd.

Connectivity, Inc.

Measurement Specialities (Chengdai) Ltd

Huawei Technologies Co., Limited

Yong Yan

Yong-Fa Fan

Dandan Zhang

Lvhai Hu

Yun Liu

Yingcong Deng

Qinglong Zeng

Qian Ying

Lan Gong

Zhao-Yi Wu

Roberto Francisco-Yi Lu

Li Sheng Liu

Qi-Yuan Li

Zhi-Guo Zhao

Xue-Li Zhang

Lin Ye

Zhan Li

Enhua He

Yan Qin

Xiao-Feng Jia

Jin-Rong Wang

Yin Meng

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

Fixing apparatus

A fixing device adapted to fix at least one needle-shaped member comprises a fixing base and a fixing mechanism. The fixing base has at least one positioning groove disposed at a front end of the fixing base. The needle-shaped member is adapted to be positioned in the positioning groove. The fixing mechanism has at least one pressing protrusion at a front end of the fixing mechanism. The pressing protrusion is adapted to press and hold the needle-shaped member in the positioning groove.

Fixing device

A wire processing apparatus comprises a frame, a clamping device mounted on the frame and adapted to clamp a wire to be processed, and a straightening and cutting device mounted on the frame. The straightening and cutting device is adapted to press a conductor of the wire into a straight shape and cut the conductor to a predetermined length after pressing.

Wire processing apparatus

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.

A welding system for welding a first elongated element and a second elongated element together by a laser beam that is emitted from a laser welding head after the ideal welding center point of the aligned first and second elongated elements has been positioned at a focal point of the laser beam that is emitted from the laser welding head.

Welding system and method

An antenna module includes a main body and a three-dimensional radiator embedded in the main body. The main body is made of foamed ceramic material. A method for making the antenna is also described.

Antenna module and method for making the same

A portable electronic device includes A portable electronic device includes a base, an antenna radiator, an outer layer, and at least one conductive contact. The antenna radiator formed on the base, the antenna radiator is made by injection molding from a mixture of materials selected from a group consisting of thermoplastic, organic filling substances, and conductive small particle sized material. The antenna radiator is sandwiched between the base and the outer layer. One end of each conductive contact is electrically connected to the antenna radiator, and the other end of the each conductive contact is exposed.

Housing of portable electronic device and method for making the same

An electronic device cover includes a base body, a first antenna and a second antenna. The first antenna is at least partially made by laser direct structuring. Both the first antenna and the second antenna are located in the base body by insert-molding.

Cover for electronic device

A housing combination includes a housing, and at least two antenna modules embedded at corners of the housing. Each antenna module includes an antenna carrier and an antenna radiator. The antenna carrier defines a first receiving groove and a second receiving groove opposite to each other. The antenna radiator includes a main portion and a conductive contact. The main portion is received in the first receiving groove, and the conductive contact is received in the second receiving groove. The main portion is embedded in the housing, and the conductive contact is exposed from the housing.

Housing combination of electronic device and method

An antenna module includes a main body and an antenna radiator located on the main body. The antenna radiator is made of a liquid conductive material mixed by metal powders and diluting agent and is directly formed on the main body. A method for making the antenna module is also described.

A portable electronic device includes a base, an antenna radiator, an outer layer, and at least one conductive contact. The antenna radiator is formed on the activated base by plating. The antenna radiator is sandwiched between the base and the outer layer. One end of each conductive contact is electrically connected to the antenna radiator, and the other end of the each conductive contact is exposed.

A device housing comprises a main body and a three-dimensional antenna. The main body comprises a first molded body and a second molded body formed on the first molding body. The first molded body is made of plastic, the second molded body is made of plastic mixed with laser activatable additives. The second molded body has a predefined activating region formed by laser activation. The three-dimensional antenna is an electroplated coating and is formed on the predefined activating region of the second molding body.

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Shenzhen, China

Yong Yan