Applied Materials, Inc.

Agency for Science, Technology and Research

Capcon Limited

Other

Asm Technology Singapore Pte Ltd

Yong Xin Wang

Doreen Wei Ying Yong

John Leonard Sudijono

Andrea Leoncini

Bhaskar Jyoti Bhuyan

Yi-Yan Yang

Yang Li

Feng Yu

Hong Gang Wang

Jackie Yi-Ru Ying

Ka Shing Kenny Kwan

Gang Ou

Ashlynn Lingzhi Lee

Man Chan

Cherng-wen Tan

Methods of patterning semiconductor devices comprising selective deposition methods are described. A blocking layer is deposited on a metal surface of a semiconductor device before deposition of a dielectric material on a dielectric surface. Methods include exposing a substrate surface including a metal surface and a dielectric surface to a heterocyclic reactant comprising a headgroup and a tailgroup in a processing chamber and selectively depositing the heterocyclic reactant on the metal surface to form a passivation layer, wherein the heterocyclic headgroup selectively reacts and binds to the metal surface.

Semiconductor device patterning methods

Methods of selectively depositing films on substrates are described. A passivation film is deposited on a metal surface before deposition of a dielectric material. Also described is exposing a substrate surface comprising a metal surface and a dielectric surface to a docking precursor to form a passivation film.

Selective deposition of a passivation film on a metal surface

Methods of enhancing selective deposition are described. In some embodiments, a passivation layer is deposited on a metal surface before deposition of a dielectric material. A block I molecule is deposited on a metal surface, and a block II molecule is reacted with the block I molecule to form a passivation layer.

Area-selective atomic layer deposition of passivation layers

Selective deposition methods are described. An exemplary method comprises exposing the substrate comprising a first surface and a second surface to an anchor reactant and selectively depositing the anchor reactant on the first surface as a seed layer, wherein the anchor reactant comprises an ethynyl derivative with a headgroup that selectively targets the first surface.

Selective deposition of a passivation film

Disclosed is a chip packaging apparatus. The chip packaging apparatus comprises: at least one chip supplying device; at least one chip processing device configured to process a chip supplied by a corresponding chip supplying device; and at least one chip transferring device, wherein each chip transferring device has a plurality of bonding heads, and each of the bonding heads is used to transfer one chip processed by a corresponding chip processing device. Each chip processing device comprises at least two pick-up platforms, each of the pick-up platforms is configured such that multiple chips can be simultaneously provided thereon, and the plurality of bonding heads on a corresponding chip transferring device is configured to simultaneously pick up multiple chips from each pick-up platform in one operation. A method for packaging chips is also disclosed.

Chip packaging apparatus and method thereof

A component packaging apparatus includes: at least one component supply device; at least one component processing device, which is configured to process components provided by the component supply device; at least one component transfer device, each component transfer device respectively having multiple bond heads, each bond head transferring one of the said components which are processed by the component processing device; wherein the component processing device comprises a pick-up platform, which is configured to simultaneously arrange the multiple components, and the multiple bond heads are configured to pick up the multiple components simultaneously from the pick-up platform at one time. A method for packaging components is also provided.

Apparatus and method for packaging components

Embodiment of the present invention provides various types of optical measurement scaleplates, optical measurement apparatus and method using the optical measurement scaleplates for position measurements. In one embodiment, an optical measurement scaleplate has a substrate and a plurality of marking units each being borne on the substrate at a predetermined position. Each marking unit includes a plurality of optically detectable marking elements. Each of said marking elements has an element value defined a permutation of the element value of each of the marking elements in said marking unit, and each unit value corresponds to a physical quantity. On the substrate there is defined a first direction. The physical quantity includes a first distance between a reference position and said predetermined position along the first direction.

Optical measurement system, method and scaleplate therefor

Articles and methods for the delivery of drugs and/or nucleic acids. Articles including a nanoparticle are provided that may be used for the delivery of a drug, a nucleic acid, or both, to a subject. The articles may be of polymeric material and may self-assemble.

Methods and articles for the delivery of therapeutic agents

There is presently provided a complex of a micelle formed from a cationic polymer and a protein, and a method using the complex to deliver the protein into a cell.

Method of delivering a protein into a cell

A bonding apparatus is provided comprising a bonding stage for holding a bonding tool, an air distribution system mounted to the bonding stage and an air inlet attached to the air distribution system. The air distribution system is connected to the air inlet for receiving air from the air inlet, and is operative to pass the air over multiple surfaces of the bonding stage for the purpose of temperature control.

Growing community of inventors

Singapore, Singapore

Yong Xin Wang