Samsung Electronics Co., Ltd.

Skhynix Inc.

Siliconfile Technologies Inc.

Yong Woon Lee

Sang Wook Ahn

Huy Chan Jung

Heui-Gyun Ahn

Do Young Lee

Sun Jin Kim

Je Hyung Cho

Heui Gyun Ahn

Alexey Bodrov

Dong Woo Ha

In Joo Kim

Sung Chun Jun

Seok Gin Kang

A power system may include a first motor, a second motor connected in parallel to the first motor, a driver configured to supply a driving current to the first motor and the second motor and a controller configured to control the driver based on the driving current and a rotating speed of the first motor, and when the rotating speed of the first motor is different from a rotating speed of the second motor, the controller may control the driver so that the rotating speed of the first motor is equal to the rotating speed of the second motor. The power system may drive two and more motors at the same speed by applying the driving voltage based on the rotating speed and the driving current of one of two or more motors, using a single driving apparatus.

Power system and motor driving apparatus included in power system

The present invention relates to a technology with enables an image signal processor to output image data at a faster speed while using a memory having a smaller capacity. The image signal processor includes a pair of line memories for storing image data output from an analog-digital converter such that the image data alternates in units of horizontal lines, and outputting the stored image data in units of blocks according to a first-in-first-out method.

Image data output device for image signal processor

The present invention provides an image processing package comprising: an image sensor for receiving an image of a subject, which is incident from the outside, in the form of light and converting the image of the subject into an image signal; and an image signal processor for processing the image signal which is output from the image sensor and reproducing the image of the subject, wherein the image processing package has a structure in which the image sensor is vertically stacked on the image signal processor.

Image processing package and camera module having same

A power supply control apparatus is connected to an electric device to control supply of power to the electric device. The apparatus includes a main power switch to apply or interrupt main power to the electric device, the main power being external input commercial AC power, an auxiliary power storage unit supplied and charged with the main power as auxiliary power, a charging/discharging unit including a charging circuit to convert the main power into DC power and charge the converted DC power in the auxiliary power storage unit, and a discharging circuit to convert the DC power in the auxiliary power storage unit into AC power and discharge the converted AC power to the electric device, and a controller to control the main power switch, and control the charging/discharging unit to selectively drive the charging circuit or the discharging circuit.

Power supply control apparatus and power supply control system having the same

A semiconductor device having improved heat-dissipation characteristics is capable effectively discharging heat that is generated inside the semiconductor device of a three-dimensional laminated structure, to the outside of the semiconductor device by utilizing an internal connector used during bonding.

Semiconductor device having improved heat-dissipation characteristics

A method for manufacturing a through-hole silicon via (TSV) employs the conventional trench insulation process to readily manufacture a through-hole silicon via (TSV) with achievement of an effective electrical insulation between the through-hole silicon via (TSV) and the silicon.

Method for manufacturing through-hole silicon via

A semiconductor memory is formed by stacking a plurality of substrates and memory cells on each substrate are connected by data dump lines. A switch may intervene between the memory cell and the data dump line. When data of each substrate is dumped by the data dump line, a problem of decrease in a speed and an increase in power consumption due to a parasitic component can be minimized. Further, a core circuit including the memory cell may be disposed on one substrate and a peripheral circuit unit may be disposed on the remaining substrates.

Growing community of inventors

Gyeonggi-do, South Korea

Yong Woon Lee