Samsung Electronics Co., Ltd.

Yong-Won Lee

Jung-Je Bang

Jae-Heung Ye

Se-Ho Park

Tae-Hun Kim

Jung-Sik Park

Jun-Young Kim

Min Jae Park

Hyun-Tae Jang

Chang-Joon Lee

Jeong-Ung Kim

Beom-Ju Kim

Kyung-Won Kang

Juno Park

Sang-Seob Kim

Nam-Su Yuk

Jun-Yeong Kim

According to various embodiments of the present disclosure, a metal unit may include: a core metal layer that is mainly composed of iron (Fe); and an outer layer formed on at least one face of the core metal layer, and bonded to solder so as to be attached to a printed circuit board. The metal unit and an electronic device including the same may be variously implemented according to embodiments.

Surface mount metal unit and electric device including same

An electronic device is provided. The electronic device includes a housing including a radiating conductor forming a portion of a side wall thereof, an electronic component disposed adjacent to the radiating conductor, a circuit board including an integrated circuit (IC) chip, and a shielding member attached to the circuit board and surrounding the IC chip.

Electronic device with electromagnetic shielding member

According to embodiments, an electronic device includes: a housing including a face facing a first direction; a circuit board including first and second board faces substantially parallel to the face, and a side board face facing a second direction, the circuit board disposed within the housing; a first component disposed in a first region of the first board face; a second component disposed in a second region of the second board face overlapping with the first region; a first shield including a first side wall formed facing the second direction, the first shield covering the first region; a second shield including a second side wall formed facing the second direction, the second shield covering the second region; and a bonding material formed between the first side wall or second side wall and the side board face. The electronic device as described above may be variously implemented according to embodiments.

Electronic device and manufacturing method of the same

A cassette transfer apparatus includes a holding unit configured to hold a cassette having a wafer loaded therein, the cassette having at least one stepped part, and the holding unit including at least one holding part configured to have the at least one stepped part placed thereon. The at least one stepped part includes a pair of stepped parts provided at opposite surfaces of the cassette, and the at least one holding part includes a pair of holding parts that extends back and forth and is configured to have the pair of stepped parts placed thereon.

Cassette transfer apparatus and cassette transferring method using the same

Growing community of inventors

Gyeonggi-do, South Korea

Yong-Won Lee