Samsung Electro-Mechanics Co., Ltd.

Yong-Wan Ji

Sang-Hoon Kim

Myung-Sam Kang

Young-Gwan Ko

Kang-Wook Bong

Hye-Won Jung

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.

Printed circuit board and method of manufacturing the same

A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.

Growing community of inventors

Gwangju-si, South Korea

Yong-Wan Ji