Electronics and Telecommunications Research Institute

Yong-Sung Eom

Kwang-Seong Choi

Jong-Hyun Lee

Jiho Joo

Byung-Seok Choi

Seok-Hwan Moon

Hyun-cheol Bae

Gwang-Mun Choi

Seok Hwan Moon

Ho-Gyeong Yun

Chanmi Lee

Jong-Tae Moon

Keon-Soo Jang

Ieeseul Jeong

Wagno Alves Braganca Junior

Ki-Seok Jang

Provided is an electronic device including a plurality of substrate electrodes on a substrate, the substrate electrodes including initial electrodes and spare electrodes, a bonding material covering the initial electrodes and the spare electrodes, module structures respectively provided on first initial electrodes of the initial electrodes, and solders between each of the first initial electrodes and each of the module structures, wherein the spare electrodes include second spare electrodes, wherein the module structures are not provided on the second spare electrodes, wherein the bonding material on the first initial electrodes is harder than the bonding material on the second spare electrodes.

Electronic device and its repair method

Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.

Method of fabricating a semiconductor package

The present invention provides a transceiver module having advantages of minimizing the number of optical parts by using an optical collimator to which a lens having the same shape as a diameter of an optical fiber is attached on a light input/output end. An transceiver module according to the present invention includes, laser diode for generating an optical signal to transmit, a first photodiode for controlling the laser diode, a second and third photodiodes for receiving an optical signal of a first and second wavelengths, and an optical collimator formed at a light input/output end. On the optical collimator, a lens having an optical fiber shape is attached in a direction the light proceeds.

Transceiver module and optical bench for passive alignment

Growing community of inventors

Daejeon, South Korea

Yong-Sung Eom