Apple Inc.

Yong Sun

Paul Stephen Drzaic

Paolo Sacchetto

Marc Joseph DeVincentis

Zhen Zhang

Anshi Liang

Han-Chieh Chang

Xin Zhao

Hopil Bae

Abbas Jamshidi Roudbari

Warren S Rieutort-Louis

Sunggu Kang

Mahdi Farrokh Baroughi

Yung-Yu Hsu

Steven E Molesa

Izhar Zahoor Ahmed

Jaein Choi

Mingjing Ha

Tiffany T Moy

Sandeep Chalasani

Francois R Jacob

Elmar Gehlen

Zuoqian Wang

Kuan H Lu

Bulong Wu

Jonathan P Mar

Ian D Tracy

Jui-Chih Liao

An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed on a display panel substrate. A display panel may extend continuously across the display or multiple display panels may be tiled in two dimensions to cover a larger display area. Interconnect substrates may have outwardly facing contacts that are electrically shorted to corresponding inwardly facing contacts such as inwardly facing metal pillars associated with the display panels. The interconnect substrates may be supported by glass layers. Integrated circuits may be embedded in the display panels and/or in the interconnect substrates. A display may have an active area with pixels that includes non-spline pixels in a non-spline display portion located above a straight edge of the display and spline pixel in a spline display portion located above a curved edge of the display.

Electronic devices with borderless displays

An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed in a display panel having a single substrate or an array of display panel tiles. The display panel has inwardly facing display panel contacts that mate with corresponding outwardly facing interconnect substrate contacts on an interconnect substrate. The interconnect substrate may have areas with compound curvature that are overlapped by the display panel. To enhance flexibility of the interconnect substrate, the interconnect substrate may have flexibility enhancement openings and/or may be formed from a material with a low elastic modulus such as silicone or other elastomeric material.

Electronic devices with curved displays

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Sunnyvale, CA, United States of America

Yong Sun