Samsung Electronics Co., Ltd.

Yong-shik Park

Kyong-il Kim

Jae-sik Min

Seo-hyun Cho

Byung-ha Park

Myong-jong Kwon

Myung-jong Kwon

Sung-Joon Park

Sang-wook Lee

Young-ung Ha

Jun-hyub Park

Kwang-Ryul Kim

Keon Kuk

Jin-wook Lee

Sung-joon Park

Eun-bong Han

Yun-gi Kim

Nam-kyun Kim

Jao-Sik Min

An inkjet printhead and a method of manufacturing the same. The inkjet printhead may include a substrate in which a manifold to supply ink is formed in a lower portion of the substrate and a plurality of ink feed holes connected to the manifold are formed in an upper portion of the substrate, feed hole guides that are formed on inner sidewalls of the ink feed holes to define lengths of the ink feed holes, a chamber layer stacked on the substrate, the chamber layer including a plurality of ink chambers connected to the ink feed holes, a plurality of heaters to heat ink inside the ink chambers to generate bubbles, and a nozzle layer stacked on the chamber layer, the nozzle layer including a plurality of nozzles, the ink being ejectable through the nozzles.

Inkjet printhead and method of manufacturing the same

An inkjet printhead includes a substrate having an ink chamber which is filled with ink to be ejected, a nozzle plate formed on the substrate in a position corresponding to the ink chamber, and a heat generating resistor installed in the ink chamber and formed of TiN, where x ranges from 0.2 to 0.5, to generate ink bubbles in the ink by generating heat.

Inkjet printhead with heat generating resistor

A filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate are provided. The filter plate includes a filter substrate having a filter hole region. Filter holes having angled line shapes extend through the filter substrate of the filter hole region. Each of the filter holes may include an upper filter hole formed to have a first angle with respect to the filter substrate at an upper portion of the filter substrate, and a lower filter hole formed at a lower portion of the filter substrate to be connected to the upper filter hole and having a second angle with respect to the filter substrate different from the first angle.

Filter plate usable with an ink jet head, an ink jet head with the filter plate, and a method of fabricating the filter plate

A method of fabricating an ink jet head having a metal chamber layer includes preparing a substrate having pressure-generating elements to generate pressure to eject ink ejection. The metal chamber layer to define sidewalls of an ink flow path is then formed on the substrate. A sacrificial layer is formed to fill a region where the ink flow path is to be formed between the sidewalls defined by the metal chamber layer. A nozzle layer having nozzles corresponding to the pressure-generating elements is formed on the metal chamber layer and the sacrificial layer.

Ink jet head including a metal chamber layer and a method of fabricating the same

An ink jet head having a channel damper, and a method of fabricating the same. The ink jet head includes a heat-generating resistor disposed on a substrate to generate pressure for ink ejection, a chamber layer disposed on the substrate to enclose the heat-generating resistor and having a first height from the substrate in order to provide at least one opened portion, and a channel damper disposed at the opened portion to completely enclose the heat-generating resistor together with the chamber layer and having a second height lower than the first height is disposed at the opened portion. A nozzle layer having a nozzle corresponding to the heat-generating resistor is disposed to be in contact with an upper surface of the chamber layer.

Ink jet head having channel damper and method of fabricating the same

A bubble-ink jet print head includes: a substrate having ink chambers to store ink and resistance heat emitting bodies to heat ink disposed thereover; and an ink supply passage which penetrates the substrate and which is connected with the ink chambers. The ink supply passage includes: a first trench formed at a first surface of the substrate in a first pattern having a separating distance from at least one of inlets of the ink chambers and connecting portions between the adjacent ink chambers, the first surface of the substrate having the ink chambers disposed thereover, and a second trench formed at a second surface of the substrate in a second pattern, having one of an area equal to and an area smaller than that of the first trench in the range of the first pattern of the first trench, and in communication with the first trench.

Bubble-ink jet print head and fabrication method thereof

An ink-jet printhead and a manufacturing method thereof include a substrate on which an ink chamber having a predetermined volume is formed, a passage for supplying ink to the ink chamber which is formed on a bottom of the ink chamber, a nozzle plate which includes a nozzle corresponding to a center of the ink chamber and at least two insulating layers formed on the substrate, a bubble guide formed inside the nozzle plate and extending from the nozzle into the ink chamber, and a heater which surrounds the nozzle and is disposed between the two insulating layers. A hydrophobic coating layer is formed on a surface of a uppermost layer of the nozzle plate, and a droplet ejecting portion that has a diameter smaller than that of the nozzle of the nozzle plate and is disposed on the same axis as the nozzle, is formed in the hydrophobic coating layer. The nozzle plate is prevented from becoming wet due to ink, stability of an ink spray and a consecutive spray performance are improved, and thus a printing quality and a printing performance of the ink-jet printhead are generally improved.

Ink-jet printhead with droplet ejecting portion provided in a hydrophobic layer

An ink-jet printhead includes a substrate on which an ink chamber is formed, and a nozzle plate to cover the ink chamber, having a nozzle through which ink droplets are ejected from the ink chamber, and formed of a stack of a multi-layer insulating layer. The ink-jet printhead also includes a heater buried in the nozzle plate to surround the nozzle, an interconnection layer buried in the nozzle plate to electrically connect to the heater, and a coating layer formed of photoresist on the nozzle plate and having a through hole-type droplet guide connected to the nozzle of the nozzle plate. The droplet guide is formed through the coating layer, which has a sufficient thickness, and enables a meniscus of ink to be rapidly restored and stabilized, and ink droplets to be ejected at a high speed and high frequency. Also, the ink-jet printhead has improved resistance to abrasion and chemicals.

Ink-jet printhead and method for manufacturing the same

Ink-jet printhead and manufacturing method thereof

Ink-jet printhead and method of manufacturing the same

A method of manufacturing a monolithic ink-jet printhead includes preparing a silicon substrate, forming an ink passage comprising a manifold supplying ink, an ink chamber filled with ink supplied from the manifold, an ink channel connecting the ink chamber to the manifold, and a nozzle through which the ink is ejected from the ink chamber, on the silicon substrate, and reprocessing a wall of the ink passage by passing XeF gas through the ink passage and dry etching the wall of the ink passage. In the reprocessing of the wall of the ink passage using XeF gas, the wall of the ink passage is smoothed, and a size of the ink passage can be more precisely adjusted to a design dimension, thereby improving a printing performance of the ink-jet printhead.

Method of manufacturing monolithic ink-jet printhead

An ink-jet print head preventing thermal accumulation on a nozzle plate includes a substrate, a channel formed in the substrate to supply ink, a nozzle plate connected to the substrate and including a nozzle corresponding to the channel, a heat element formed in the nozzle plate to surround the nozzle, a thermal conduction layer formed on an upper side of the heat element formed between the thermal conduction layer and the heat element, and a thermal shunt spaced-apart from the heat element by a predetermined distance not to overlap the heat element in a direction parallel to the nozzle plate and connecting the thermal conduction layer to the substrate. Redundant heat generated from the heat element is not accumulated on a membrane of the nozzle plate but is rapidly absorbed into an inorganic thermal conduction layer formed in the membrane and is transferred to the bulk silicon substrate through a metallic thermal bridge, such as the thermal shunt.

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Gyeonggi-do, South Korea

Yong-shik Park