Semes Co., Ltd.

Hyundai Motor Company

Kia Corporation

Dong-a Metal Co., Ltd.

Yong Seok Jang

In Kyu Park

Chung Woo Lee

Sung Youn Jeon

Yong Gyo Seo

Han Il Jung

The present disclosure provides a control device for charging and auto teaching of a wafer type sensor, a control program executed by the control device, a wafer type sensor storage device, a wafer type sensor charging device, and a semiconductor device manufacturing facility. The control program is a program executed by a control device equipped with a processor, and monitors a semiconductor device manufacturing facility and its part using a wafer type sensor, and monitors the remaining battery level of the wafer type sensor.

Control program, container and semiconductor device manufacturing system for charging of wafer type sensor and auto teaching

Provided is a gap measuring method capable of accurately measuring a gap between adjacent members. The gap measuring method includes preparing an equipment to be measured including a first member and a second member, obtaining a first image by capturing the equipment to be measured using a photographing module of a first setting while irradiating a laser to the equipment to be measured, wherein the first image includes a first laser line image corresponding to a surface of the first member and a second laser line image corresponding to a surface of the second member, modifying the photographing module from the first setting to a second setting based on a maximum width of the second laser line image in the first image, obtaining a second image by capturing the equipment to be measured using the photographing module of the second setting while irradiating a laser to the equipment to be measured, and calculating a gap between the first member and the second member based on a discontinuous region between the first laser line image and the second laser line image in the second image.

Apparatus and method for measuring the gap

A support unit may include a plurality of heaters disposed in a matrix form in the support unit to heat a substrate, and a power supply unit for supplying power to the plurality of heaters, wherein a current applied to the plurality of heaters is controlled by switches connected to rows and columns of the matrix, respectively, and the switches connected to the rows of the matrix include first switches capable of controlling the current applied to the rows of the matrix and second switches connected in parallel with the first switches.

Support unit, substrate treating apparatus including the same and temperature control method

A clamp has a structure including a band portion wrapping a circular member, such as a hose, a washer portion, a nut portion, and a connection portion and support portions that prevent the band portion from being deformed when a bolt is tightened, these portions being integrally formed with each other into a single portion. Therefore, reduction in the separate portions causes cost reduction, weight reduction, and reduction in risk of loss of the separate portions, and the performance problem in that the clamp rotates when the tightening work is performed by rotation of the bolt is improved.

Clamp

Disclosed is a substrate treating apparatus. The substrate treating apparatus includes an index unit including a load pot, in which a container is seated, and an index chamber connected to the load pot, and a process executing unit having a load lock chamber connected to the index chamber and a process chamber that treats a substrate transferred to the load lock chamber, the index unit further includes an alignment unit provided in the index chamber and that aligns a substrate type sensor transferred to the process chamber.

Substrate treating apparatus

Disclosed is an air pressure control (APC) device according to an embodiment of the inventive concept. The air pressure control (APC) device may include a processing chamber, a plate for adjusting a pressure in the processing chamber, and an APC valve including first and second step motors for adjusting a height of the plate, and an APC controller that controls the APC valve, and the APC controller may include a first controller that controls positions of the first step motor and the second step motor; and a second controller that compensates for a difference in position between the first step motor and the second step motor.

Growing community of inventors

Chungcheongnam-do, South Korea

Yong Seok Jang