Samsung Electronics Co., Ltd.

Lg Innotek Co., Ltd.

Humax Co., Ltd.

Yong Seok Cho

Hyung Joon Kim

Joo Young Lee

Sang Ah Lee

Jung Ho Kim

Eun Yeoung Choi

Su Hyeong Lee

Joong Yun Ra

Sung Hae Lee

Seung Kyu Lee

Won Sang Park

Jae Hyun Kim

Sung June Park

Bio Kim

Jae Young Ahn

Soo San Kim

Yong Suk Yeo

Jung Hun Jung

Bi O Kim

Ki Yong Oh

Chang Sung Kim

Disclosed are a printed circuit board connector according to an embodiment and a module device including same. The printed circuit board connector comprises: a substrate; holes formed in the substrate at predetermined intervals and coated with a metal material on the inner circumferential surface thereof so as to form a metal layer; a first metal pad formed at one end of the holes and connected to the metal layer; and a second metal pad formed at the other end of the holes and connected to the metal layer.

Printed circuit board connector and module device comprising same

A substrate module according to an embodiment of the present invention comprises: a first substrate which includes transformer connection part to be connected to terminals of a transformer, at least one second substrate on which a switch module to be connected to the transformer is formed; and a conductive connector which connects the first substrate and the second substrate to each other, wherein the first substrate and the second substrate are arranged by the conductive connector such that a predetermined angle is formed therebetween.

Substrate module and power module for transformer

A camera module comprises: a first housing; a lens module disposed in the first housing; a second housing coupled to the first housing; a first printed circuit board disposed in the inner space of the first housing and the second housing; an image sensor disposed on the first printed circuit board; and a shield can disposed under the first printed circuit board in the second housing, wherein the shield can comprises a rib which comes into contact with the lower surface of the first printed circuit board.

Camera module with shield can

A cell balancing module according to an embodiment of the present invention comprises: a main board on which a plurality of cell balancing resistors are mounted; at least one sub-board on which a plurality of cell balancing resistors are mounted and which is formed above the main board while being spaced a predetermined distance apart therefrom; and at least one connector which supports the sub-board to be spaced apart from the main board and electrically connects the sub-board to the main board.

Cell balancing module

A semiconductor device includes a plurality of first gate electrodes sequentially stacked on a substrate, a second gate electrode on the plurality of first gate electrodes, a first channel structure extending through the plurality of first gate electrodes and a portion of the second gate electrode, a buried insulation pattern on a sidewall of the first channel structure, of which an upper surface is at a higher level than a top end of the first channel structure, a second channel structure extending through a remainder of the second gate electrode, the second channel structure connected to the first channel structure, and a buried conductive pattern on a sidewall of the second channel structure.

Method of manufacturing three dimensional semiconductor device including first and second channels and buried insulation and conductive patterns

Three dimensional semiconductor device including first and second channels and buried insulation and conductive patterns and method of manufacturing the same

A method for fabricating a semiconductor device, the method including forming a mold structure on a substrate such that the mold structure includes alternately and repeatedly stacked interlayer insulating films and sacrificial films; forming a channel hole passing through the mold structure; forming a vertical channel structure within the channel hole; exposing a surface of the interlayer insulating films by removing the sacrificial films; forming an aluminum oxide film along a surface of the interlayer insulating films; forming a continuous film on the aluminum oxide film; and nitriding the continuous film to form a TiN film.

Method for fabricating semiconductor device

A method of manufacturing a semiconductor device includes forming a mold structure including alternately stacked mold insulating and sacrificial layers on a substrate, forming a vertical structure through the mold structure, forming side openings by removing the sacrificial, forming a preliminary dielectric layer in the side openings, forming a dielectric layer by heat-treating the preliminary dielectric layer, removing a surface layer of the dielectric layer, forming a first conductive layer covering the dielectric layer in the side openings, and forming a second conductive layer covering the first conductive layer and filling the side openings.

Method of manufacturing semiconductor device

Disclosed is a printed circuit board. The printed circuit board includes an insulating layer, a copper foil formed on the insulating layer and formed therein with a groove to expose a portion of a top surface of the insulating layer, and a thermal conductive layer filled in the groove.

Printed circuit board and method of fabricating the same

Disclosed is an edge sharpening method using maximum and minimum filters. In an embodiment of the present invention, the edge region of an input image signal is detected, minimum and maximum signals are generated for the detected edge region, the input signal of the detected edge region is compared with the average signal of the minimum and maximum signals, and the average of the input signal and the maximum signal is output if the input signal is larger than the average signal, the average of the input signal and the minimum signal is output if the input signal is smaller than the average signal, and the input signal is output if the input signal is equal to the average signal. Meanwhile, median filtering, using a window perpendicular to the direction in which the edge sharpening is performed, is performed on the region on which the edge sharpening has been performed.

Image processing method and apparatus

A liquid crystal display panel capable of preventing flicker and improving reflectance include a thin film transistor substrate having a gate line, a data line, a thin film transistor connected to the gate and data lines, and a reflective electrode connected to the thin film transistor and covering at least part of the gate line, a color filter substrate having a color filter and a common electrode forming an electric field with the reflective electrode. Liquid crystals are disposed between the thin film transistor substrate and the color filter substrate. The reflective electrode shields the liquid crystals from a gate signal.

Growing community of inventors

Seoul, South Korea

Yong Seok Cho