Lg Innotek Co., Ltd.

E.i. Dupont De Nemours and Company

Lg Electronics Inc.

Nanopyxis Co., Ltd.

Huf Hülsbeck & Fürst Gmbh Co.kg

Yong Sang Cho

Jae Hyuk Jang

Jong Min Lee

Myoung Lae Roh

Boone Won

Jong Bae Shin

Sang Gon Kim

Sook Hyun Kim

Chae Hoon Kim

Jay Robert Dorfman

Jin Gyeong Park

James Daniel Tremel

Terri Cardellino

Sang Hoon Lee

Ki Hwan Kim

Kyoung Hoon Chai

Man Hue Choi

Young Kil Song

Young Sun You

Jeung Ook Park

Stefan Neuhoff

Hyung Eui Lee

Jong Hyun Kang

Se Woon Lee

Mu Ryong Kim

Won Yong Yoon

Joon Rak Choi

Kwang Il Kim

Chi Hun Lee

Jong Woon Moon

Sebastian Raulin

Yong Sang Lee

Won Jong Choi

Seung Pyo Noh

Joung Youl Kim

Seung Hwan Jang

Hyeok Soo Suh

A thermoelectric device according to an embodiment of the present invention comprises: a first substrate; an insulating layer disposed on the first substrate; a first electrode unit disposed on the insulating layer; a first terminal electrode and a second terminal electrode disposed on the insulating layer and protruding from the first electrode unit toward the first outer side of the first substrate; a semiconductor structure disposed on the first electrode unit; a second electrode unit disposed on the semiconductor structure; and a second substrate unit disposed on the second electrode unit. The second substrate unit comprises a plurality of second substrates disposed away from one another. The first electrode unit comprises: a plurality of electrode groups respectively overlapping the plurality of second substrates vertically; and a first connection electrode connecting two different electrode groups among the plurality of electrode groups. The long side of the first connection electrode is longer than the long side of the first electrode included in the plurality of electrode groups. At least a part of the first connection electrode does not overlap the plurality of second substrates vertically.

Thermoelectric device

A thermoelectric element according to one embodiment of the present disclosure includes a first substrate, a first insulating layer disposed on the first substrate, a second insulating layer disposed on the first insulating layer, a first electrode disposed on the second insulating layer, and a semiconductor structure disposed on the first electrode, wherein the first insulating layer includes an uneven portion, a partial region of the first electrode is buried in the second insulating layer, the second insulating layer includes a concave portion which is concave in a direction toward the first insulating layer from a side surface of the first electrode, and the concave portion vertically overlaps the uneven portion.

Thermoelectric element

A thermoelectric element according to an embodiment of the present invention comprises: a first metal substrate; a first resin layer disposed on the first metal substrate and in direct contact with the first metal substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metal substrate disposed on the second resin layer, wherein the first resin layer comprises a polymeric resin and an inorganic filler and at least a part of side surfaces of the plurality of first electrodes are embedded in the first resin layer.

Disclosed is an embodiment is a thermoelectric module comprising: a first thermally conductive plate; a thermoelectric element arranged on the first thermally conductive plate; a second thermally conductive plate arranged on the thermoelectric element; and a cover frame, which is arranged on the first thermally conductive plate, and has an accommodation space such that the thermoelectric element is accommodated in the accommodation space, wherein the thermoelectric element includes: a first substrate; a plurality of thermoelectric legs arranged on the first substrate; a second substrate arranged on the plurality of thermoelectric legs; and electrodes comprising a plurality of first electrodes arranged between the first substrate and the plurality of thermoelectric legs; and a plurality of second electrodes arranged between the second substrate and the plurality of thermoelectric legs, and the cover frame includes: an outer frame arranged to be spaced from the thermoelectric element on the first thermally conductive plate; and an upper frame extending toward the second thermally conductive plate so as to be inclined from the upper end of the outer frame toward the downward direction thereof.

Thermoelectric module

A thermoelectric element according to an embodiment of the present invention comprises: a first metallic substrate; a first resin layer which is disposed on the first metallic substrate and comes in direct contact with the first metallic substrate; a plurality of first electrodes disposed on the first resin layer; a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs disposed on the plurality of first electrodes; a plurality of second electrodes disposed on the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a second resin layer disposed on the plurality of second electrodes; and a second metallic substrate disposed on the second resin layer, wherein a surface of the first metallic substrate that faces the first resin layer comprises a first region and a second region disposed inside the first region, wherein a surface roughness of the second region is greater than a surface roughness of the first region, wherein the first resin layer is disposed on the second region.

Thermoelectric element and manufacturing method thereof

A thermoelectric module according to one embodiment of the present invention comprises: a first substrate; a thermoelectric element disposed on the first substrate; a second substrate disposed on the thermoelectric element and having a smaller area than the first substrate; a sealing part disposed on the first substrate and surrounding a side surface of the thermoelectric element; and a wire part connected to the thermoelectric element, drawn out through the sealing part, and supplying power to the thermoelectric element, wherein the sealing part has a through hole through which the wire part passes, and the through hole is disposed closer to the second substrate than the first substrate.

The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Thermoelectric module, and heat conversion apparatus comprising the same

Provided is a dehumidifier including: a dehumidification module including a compressor unit for compressing a refrigerant, a cooling unit for cooling air through the refrigerant, and a drying unit for drying air that passes through the cooling unit; and a thermoelectric module including a first substrate, a second substrate disposed to face the first substrate, a thermoelectric element disposed between the first substrate and the second substrate, a first heat conversion unit connected to the first substrate and disposed adjacent to the drying unit of the dehumidification module, and a second heat conversion unit connected to the second substrate and disposed adjacent to the cooling unit of the dehumidification module.

Dehumidifier

Provided is a heat conversion device, including: a housing; a thermoelectric module received in the housing and including a thermoelectric semiconductor between substrates disposed to face each other; a first temperature conversion portion and a second temperature conversion portion disposed between the substrates, respectively; and a heat reduction portion adopted to guide a part of a fluid flowing in the housing and passing through the first temperature conversion portion to the second temperature conversion portion.

Heat conversion device

Disclosed are a wire and a method for manufacturing the same. The method includes heating a solvent, adding a capping agent to the solvent, and forming a metallic wire by adding a metallic compound to the solvent. The solvent includes a first solvent having a first reduction power and a second solvent having a second reduction power greater than the first reduction power. The capping agent includes a first capping agent containing a polymer having a first molecular weight, and a second capping agent containing a polymer having a second molecular weight greater than the first molecular weight.

Nano-wire and method for manufacturing the same

Provided is a heat conversion device including a thermoelectric element, the heat conversion device capable of implementing a heat conversion function of high efficiency in spite of low power consumption by disposing a heat absorption module and a heat emission module in a horizontal direction in a structure of a heat exchange device to which a thermoelectric module is applied, and by implementing a heat conversion effect for air while maintaining a desired air volume and air velocity without flow path resistance.

Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Thermoelectric material and thermoelectric element including the same

A method and apparatus for transmitting data in a wireless communication system are disclosed, which transmit uplink data in consideration of mobile station (MS) consumption power such that a UE can be stably operated at a cell edge. A method for transmitting data by a mobile station (MS) of a wireless communication system includes transmitting, if MS power consumption is higher than limitation of power consumption, data to a base station (BS) with power higher than the limitation of power consumption using power supplied from a primary power-supply unit and a storage unit during a first time, and charging the storage unit using the primary power-supply unit during a second time, wherein the limitation of power consumption indicates maximum power amount capable of being normally supplied from the primary power-supply unit.

Method and apparatus for transmitting data in wireless communication system

Growing community of inventors

Seoul, South Korea

Yong Sang Cho