Avary Holding (shenzhen) Co., Limited.

Qing Ding Precision Electronics (huaian) Co., Ltd

Hongqisheng Precision Electronics (qinhuangdao) Co., Ltd.

Garuda Technology Co., Ltd.

Hong Heng Sheng Electronical Technology (huaian) Co., Ltd.

Yong-Quan Yang

Yong-Chao Wei

Han-Pei Huang

Lin-Jie Gao

Ying Wang

Wei-Tao Ye

A circuit board includes a circuit substrate. The circuit substrate includes an insulating substrate and an electronic component embedded therein. The insulating substrate defines two first slots. A first phase change material fills in the two first slots and thermally connects to the electronic component. A first wiring layer is formed on a surface of the insulating substrate, the first wiring layer covers the two first slots and thermally connects to the first phase change material. A second wiring layer is formed on another surface of the insulating substrate. The second wiring layer includes a plurality of wiring portions and a wiring slot formed between adjacent wiring portions. The electronic component electrically connects to the second wiring portion. A second phase change material fills in at least one wiring slot and thermally connects a portion of the wiring portions together to form a heat dissipation zone.

Circuit board with embedded electronic component and manufacturing method thereof

A component embedded circuit board includes a printed circuit board, a dielectric layer, and an antenna structure laminated in that order. The printed circuit board includes a first opening and a first circuit layer, and the first circuit layer includes at least one first connecting pad. A second opening is defined in the dielectric layer. A conductive structure is embedded in the dielectric layer. The second opening penetrates the dielectric layer. The antenna structure includes a first ground layer. A component is embedded in the first opening. One end of the conductive structure is connected to the first ground layer, and the other end of the conductive structure is connected to the first connecting pad. The second opening corresponds to the first opening. A gap is generated by the second opening and the component. A method for manufacturing the package circuit structure is also disclosed.

Method for manufacturing component embedded circuit board

A method for manufacturing a fixing belt for a wearable device, includes providing a flexible circuit board including a first area, a second area, and a pad in the first area; disposing an insulating layer on the flexible circuit board, the insulating layer being disposed in the second area; forming an electric conductive portion in the insulating layer; disposing a first protective layer and a second protective layer on opposite surfaces of the flexible circuit board, the electric conductive portion being between the flexible circuit board and the first protective layer; mounting an electronic component on the pad. A portion of the fixing belt containing the second area is a plug-in area, and the plug-in area is configured to be engaged with a device body of the wearable device, the electric conductive portion is disposed in the plug-in area.

Fixing belt of wearable device, method for manufacturing the same, and wearable device

An antenna module includes an inner circuit board, an antenna circuit board, an outer circuit board, and at least one chip. The inner circuit board includes at least one inner wiring layer and at least one inner dielectric layer. The antenna circuit board includes at least one antenna structure. The antenna circuit board and the outer circuit board are disposed on opposite sides of the inner circuit board. The inner wiring layer comprises at least one inner pad. At least one first opening passing through the outer circuit board is defined to expose the inner pad. Each chip is received in one first opening and electrically connects to the inner pad. The antenna structure electrically connects to the chip through the inner wiring layer. A method for manufacturing such antenna module is also provided.

Antenna module and method for manufacturing the same

Component embedded circuit board with antenna structure and method for manufacturing the same

A method for manufacturing a circuit board with a small size a communication unit comprising a radio frequency (RF) component, an antenna, and an encapsulation layer. The RF component is embedded in the encapsulation layer, the antenna is positioned on the encapsulation layer and electrically connected to the RF component. A rigid substrate is formed on a flexible substrate, and a receiving groove is defined in the rigid substrate to expose the flexible substrate. The communication unit is in the receiving groove, thus causing connection between the RF component and the flexible substrate, thereby the circuit board is formed.

Circuit board and method for manufacturing the same

A high-frequency circuit board includes a first circuit structure, a second circuit structure, and a dielectric layer formed on the second circuit structure. The first circuit structure includes a first substrate layer and at least one first circuit layer. The at least one first circuit layer is formed on at least one surface of the first substrate layer. At least one receiving cavity is defined in the first substrate layer. A second circuit structure is embedded in the receiving cavity. The second circuit structure includes a second substrate layer, at least one second circuit layer embedded in the second substrate layer, and a plurality of support columns formed on the second substrate layer. A portion of the dielectric layer is filled into gaps between an inner wall of the receiving cavity and the second circuit structure. The support columns are embedded in the dielectric layer.

High-frequency circuit board and method for manufacturing the same

A method of manufacturing a circuit board includes: a single-sided copper-clad base is provided; a plurality of grooves are defined in the base facing away from the copper-clad side for receiving electronic elements, a depth of each of the grooves is equal to a thickness of the corresponding electronic element; the electronic elements are fixed into their respective grooves; a plurality of holes are defined in the laminating member to expose the electrodes of the electronic elements; an electroplated layer is formed on the surface of the embedded body, the electroplated layer is electrically connected with the electrodes of the electronic elements. A circuit board made by the method is also provided.

A circuit board includes at least two circuit board units. Each of the circuit board units includes a baseboard having a conductive hole filled with an electrical conductor, and a cover layer arranged on the baseboard and defining at least one trench and at least one opening. The at least one opening exposes out the electrical conductor. A circuit pattern is embedded in the at least one trench and includes a connecting portion. The connecting portion is embedded in the opening and is electrically coupled to the electrical conductor. The at least two circuit board units are stacked. Two sides of the at least one cover layer are respectively adhered to the corresponding baseboard. Two ends of the at least one connecting portion are respectively electrically coupled to the corresponding electrical conductor and electrically coupled the two adjacent circuit patterns.

Growing community of inventors

Qinhuangdao, China

Yong-Quan Yang