Lg Electronics Inc.

Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Shangrao Jinko Solar Technology Development Co., Ltd

Yong Min Song

Jong Sik Paek

Doo Hyun Park

Pil Je Sung

Sung Geun Kang

Seong Min Seo

Wang Gu Lee

Seo Yeon Ahn

Eun Young Lee

Jin Young Kim

Won Tae Kim

Joonho Jeon

Jungguen Kim

Eonjoo Hwang

Deok Soo Kim

Jeonghun Woo

Jae Hong Jun

Chul Hwan Lee

Hae Young Jung

Do Hyung Kim

Won Chul Do

In Bae Park

Jin Hee Park

Junghwan Yeom

Gun Su Kim

Byung Ho Rhee

Chang Min Lee

Geun Soo Lim

Yunkwon Jung

Kam Gyu Lee

Suchang Lee

Youngchan Park

Yoonsuk Choi

Jae Buem Bae

Ju Ho Ock

Daehyun Shin

Mi Ok Kim

Youngbok Jung

Byung Jun Mun

Hae Rim Lee

SungGeun Kang

Tae Hwa Hwang

Jangyong Kim

Yong Woo Kim

Byeong Uk Lee

Byungho Rhee

Deok Seo Kim

Hyoung Gun Moon

Jun Hee Kong

Jong Yoon Keum

Sung Jin Hwang

Eun Joo Hwang

Jae Won Shim

Takeshi Kuwahara

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Semiconductor device and manufacturing method thereof

A solar cell module can include a plurality of solar cells, each solar cell among the plurality of solar cells including a first electrode and a second electrode arranged in parallel on a rear surface of a semiconductor substrate; a substrate including a conductive pattern electrically connecting the plurality of solar cells with each other; and a protective film disposed on the plurality of solar cells on a front surface of the substrate, in which the conductive pattern includes: a plurality of conductive portions, each of the plurality of conductive portions being arranged between two adjacent solar cells among the plurality of solar cells, an electrode portion formed on a rear surface of the substrate, and a connection portion connected to the electrode portion and surrounding a side surface of the substrate.

Solar cell module and fabricating methods thereof

A solar cell panel can include solar cell parts including a solar cell and a wiring member connected to the solar cell; a first cover member disposed at a front surface of the solar cell; a second cover member disposed at a rear surface of the solar cell; a sealing member disposed between the first cover member and the second cover member, the sealing member surrounding the solar cell parts; and one or more of a plurality of fixing members including at least one of a first fixing member and a second fixing member, in which the first fixing member is disposed at a rear surface of the first cover member and fixes at least part of one of the solar cell parts to the first cover member, and the second fixing member fixes the second cover member to the first cover member.

Solar cell panel and method for manufacturing the same

A solar panel can include at least one solar cell having a first surface and a second surface facing in mutually opposing directions; a first substrate disposed on the first surface of the at least one solar cell; a first encapsulant disposed between the first substrate and the at least one solar cell; a second substrate disposed on the second surface; and a second encapsulant disposed between the second substrate and the at least one solar cell, in which the second substrate includes a steel plate or fiber reinforced plastic.

Solar panel and car roof

A photovoltaic module and a photovoltaic system including the same are disclosed. The photovoltaic module includes a solar cell module, a converter unit to convert levels of direct current (DC) power from the solar cell module, an inverter unit to convert the DC power into alternating current (AC) power, a cable electrically connected to the inverter unit and to output the AC power to an outside, a communication unit to exchange data with another photovoltaic module, and a controller to control outputting of at least one of phase information and amplitude information of the photovoltaic module for adjusting at least one of a phase and an amplitude of the another photovoltaic module, when the photovoltaic module is set as a master. Consequently, the phase and/or the amplitude of AC power output from another photovoltaic module may be adjusted to be equal.

Photovoltaic module and photovoltaic system comprising the same

In one embodiment, a semiconductor package includes a semiconductor die having conductive pads. A lead frame is directly connected to the conductive pads using an electrochemically formed layer or a conductive adhesive layer thereby facilitating an electrical connection between the conductive pads of the semiconductor die and the lead frame without using separate wire bonds or conductive bumps.

Semiconductor package with semiconductor die directly attached to lead frame and method

A method for a semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include bonding a first semiconductor die to a second semiconductor die, the first semiconductor die having a first surface comprising bond pads, a second surface opposite the first surface that is bonded to a first surface of the second semiconductor die, and sloped sides surfaces between the first and second surfaces of the first semiconductor die, such that a cross-section of the first semiconductor die is trapezoidal in shape. A passivation layer may be formed on the first surface and sloped side surfaces of the first semiconductor die and the first surface of the second semiconductor die. A redistribution layer may be formed on the passivation layer formed on the first surface and sloped side surfaces of the first semiconductor die and the first surface of the second semiconductor die.

Semiconductor device utilizing redistribution layers to couple stacked die

A semiconductor device utilizing redistribution layers to couple stacked die is disclosed and may include a first semiconductor die with a first surface comprising bond pads, a second surface opposite the first surface, and sloped side surfaces between the first and second surfaces, such that a cross-section of the first die is trapezoidal in shape. A second semiconductor die with a first surface may be bonded to the second surface of the first die, wherein the first surface of the second die may comprise bond pads. A passivation layer may be formed on the first surface and sloped side surfaces of the first die and the first surface of the second die. A redistribution layer may be formed on the passivation layer, electrically coupling bond pads on the first and second die. A conductive pillar may extend from a bond pad on the second die to the second redistribution layer.

Semiconductor device utilzing redistribution layers to couple stacked die

A plasma display apparatus and method of driving the plasma display apparatus are described. The plasma display apparatus has a plasma display panel that has a first electrode, a second electrode, and a third electrode. The plasma display apparatus also includes a first driver, a second driver and a third driver. The first driver supplies to the first electrode a first signal that decreases gradually from a first voltage to a second voltage during a setdown period of a reset period. The third driver supplies to the third electrode a third signal that increases from a third voltage to a fourth voltage during the setdown period of the reset period.

Plasma display apparatus and method of driving

There is provided a plasma display device. The plasma display device includes a plasma display panel (PDP) and drivers for supplying driving signals to the PDP. The driver includes a capacitor, a first switch turned on in order to supply a voltage of a first end of both ends of the capacitor to the PDP, a second switch turned on in order to supply a voltage of a second end of both ends of the capacitor to the PDP, a first voltage supplier connected to the first end of the capacitor to supply one of a sustain voltage and a reference voltage to the first end, and a second voltage supplier connected to the second end of the capacitor to supply the reference voltage to the second end. A voltage difference between the both ends of the capacitor is sustained as the sustain voltage. In the plasma display device, since the conventional large capacity of pass switch and the negative polar scan voltage source&#x2014;Yy are replaced by cheap capacitors with the driving signals for driving the PDP applied in the same way, it is possible to reduce the manufacturing cost of the plasma display device.

Plasma display device

A plasma display panel adapted to minimize noise/vibration as well as a heat generated therefrom. In the plasma display panel, a display panel displays a picture while a porous pad is provided behind the display panel to prevent the transfer of noise/vibration to an associated heat proof panel. When the PDP is mounted within a case, a second porous pad can be provided on an inner surface of the case opposite the display panel and adjacent to an associated printed circuit board for additional noise/vibration damping.

Plasma display panel with porous panel

An image display apparatus is provided. At least one heat radiating frame is stacked in a heat radiating frame coupled between a circuit board and a panel, a heat radiating frame to which the circuit board is fixed can secure a space by a height of a protruded part as the protruded part is formed by drawing the frame itself, and thus fastening means for fixing the circuit board without a PEM nut can be fastened, and as a sound absorbing material is filled within a protruded part formed in a heat radiating frame opposite to the panel, vibration noise generating when driving the panel can be reduced.

Image display apparatus

Growing community of inventors

Pusan-shi, South Korea

Yong Min Song