Samsung Electronics Co., Ltd.

Samsung Electro-mechanics Co., Ltd.

Yong Min Kim

Jae Hun Kim

Jong Yun Kim

Ji Hyuk Lim

Sung Hyun Sim

Kyung Wook Hwang

Geon Wook Yoo

Young Tae Kim

Soo Jin Jung

Jung Il Kim

Kang Wook Kim

Jae Gon Son

Ichiro Tanaka

Jung Sung Kim

Dong Myung Shin

Heun Ku Kang

A coil component includes a body having one surface and the other surface, opposing each other, and both end surfaces, opposing each other, a support substrate disposed inside the body, and including a core portion, and a support portion connected to the core portion, a coil portion disposed on the core portion, and a lead portion disposed on the support portion and connected to the coil portion to be exposed to one surface of the body. The support portion is disposed to be more adjacent to the one surface of the body than the core portion.

Coil component and method for manufacturing the same

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed to an external surface of the body, and a protrusion embedded in the body to be connected to the lead-out portion, and spaced apart from the external surface of the body and each of the coil portion.

Coil electronic component

A coil electronic component includes an insulating substrate, a coil portion disposed on at least one surface of the insulating substrate, a body in which the insulating substrate and the coil portion are embedded, a lead-out portion connected to the coil portion and exposed from a surface of the body, and a connection portion including a plurality of connecting conductors each having a bent portion to increase lengths of the plurality of connecting conductors embedded in the body, the plurality of connecting conductors being spaced apart from each other, the connection portion connecting an end of the coil portion to the lead-out portion to each other.

A nanostructure semiconductor light emitting device includes a base layer, an insulating layer, a plurality of light emitting nanostructures, and a contact electrode. The base layer is formed of a first conductivity-type semiconductor material. The insulating layer is disposed on the base layer. Each light emitting nanostructure is disposed in a respective opening of a plurality of openings in the base layer, and includes a nanocore formed of the first conductivity-type semiconductor material, and an active layer and a second conductivity-type semiconductor layer sequentially disposed on a surface of the nanocore. The contact electrode is spaced apart from the insulating layer and is disposed on a portion of the second conductivity-type semiconductor layer. A tip portion of the light emitting nanostructure has crystal planes different from those on side surfaces of the light emitting nanostructure.

Nanostructure semiconductor light emitting device

A semiconductor light emitting device includes a light emitting structure, a first electrode unit, and a second electrode unit. The light emitting structure includes a first and second conductivity-type semiconductor layer, an active layer. The first electrode unit includes a first electrode pad and a first electrode finger extending from the first electrode pad, and having an annular shape with an open portion. The second electrode unit includes a second electrode pad and a second electrode finger extending from the second electrode pad, and has an annular shape with an open portion. One of the first and second electrode units substantially surrounds the other, and the center of the annular shape of at least one of the first and second electrode units is spaced apart from the center of the upper surface of the light emitting structure.

Semiconductor light emitting device

There are provided a chip resistor and a method of manufacturing the same. The chip resistor includes a ceramic substrate; an adhesion portion formed on a surface of the ceramic substrate; and a resistor formed on the adhesion portion, wherein the adhesion portion includes at least one of copper (Cu), nickel (Ni), and copper-nickel (Cu&#x2014;Ni).

Chip resistor and method of manufacturing the same

Disclosed is a digital broadcasting reception apparatus for simultaneously capturing a camera image and a digital broadcasting image and a method thereof. The digital broadcasting reception apparatus includes a digital broadcasting reception unit for receiving digital broadcasting data, an image collection unit for collecting images under external control, a collected image processing unit for displaying the collected image with a camera preview screen, an image combination unit for combing the digital broadcasting data with the camera preview screen, and a display unit for displaying a combined result from the image combination unit and a DMB image and a camera image through a multiple-layered overlay structure.

Growing community of inventors

Suwon-si, South Korea

Yong Min Kim