Samsung Electro-mechanics Co., Ltd.

Yong Min Hong

Ki Pyo Hong

Jong Ho Lee

Jae Yeol Choi

Yong Jong Park

Min Woo Kim

Eun Jung Lee

Sim Chung Kang

Jung Tae Park

Ji Hun Jeong

Sun Mi Kim

Yeong Ju Choe

Je Sik Yeon

Chun Soo Kim

Ji Hyeon Lee

A method of manufacturing a multilayer electronic component, the method includes, attaching a margin portion green sheet including a ceramic material, a photocuring agent, and a photoinitiator to at least one end surface of each of the plurality of cut ceramic green sheet stacked bodies in the third direction, an energy irradiation operation of irradiating, with energy, the margin portion green sheet to generate a photocuring polymerization reaction between the photocuring agent and the photoinitiator.

Multilayer electronic component and method of manufacturing multilayer electronic component

Disclosed herein are relates to a method for compressing a laminate and a method for manufacturing a ceramic electronic component including a laminate. The method for compressing a laminate includes: preparing a laminate; pressurizing the laminate from a first pressure to a second pressure; heating the laminate from a first temperature to a second temperature; maintaining compression of the laminate at the second pressure and the second temperature for a predetermined time; cooling the laminate from the second temperature to a third temperature; and depressurizing the laminate from the second pressure to a third pressure, wherein the second temperature is 70° C. to 150° C.

Method for compressing laminate and method for manufacturing ceramic electronic component including laminate

A multilayer electronic component and a method of manufacturing the same are provided. The multilayer electronic component includes a body including a multilayer structure in which first internal electrode patterns and second internal electrode patterns different from the first internal electrode patterns are alternately stacked and containing a dielectric material. First and second side parts are disposed on respective outer surfaces of a first pair of opposing outer surfaces of the body. First and second external electrodes are disposed on respective outer surfaces of a second pair of opposing outer surfaces of the body, and the first and second external electrodes are electrically connected to the first and second internal electrode patterns, respectively. The first internal electrode patterns are exposed to the outer surfaces of the first pair of outer surfaces of the body on which the first and second side parts are disposed.

Multilayer electronic component having first internal electrode base patterns exposed to an end and opposing side surfaces of a body, and method of manufacturing the same

Multilayer electronic component with side parts on external surfaces, and method of manufacturing the same

A multilayer electronic component includes a body, first and second external electrodes, and first and second side parts. The body includes a multilayer structure in which first and second internal electrode patterns are alternately stacked and contains a dielectric material. The first and second side parts are disposed on outer surfaces of the body to face each other. The first and second external electrodes are disposed on outer surfaces of the body to face each other. The first internal electrode patterns are exposed to a third surface and a fifth surface of the body on which the first external electrode and the first side part are disposed, respectively. Additionally, the second internal electrode patterns are exposed to a fourth surface and a sixth surface of the body on which the second external electrode and the second side part are disposed, respectively.

Multilayer electronic component having first and second internal elctrode patterns alternately stacked, and method of manufacturing the same

Multilayer electronic component having first and second internal electrode base patterns exposed to different respective end and side surfaces of a body, and method of manufacturing the same

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Suwon-si, South Korea

Yong Min Hong